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10AX027E4F29E3SG
IC FPGA 360 I/O 780FBGA
- 제조업체
- Mfr.부분 #10AX027E4F29E3SG
- 패키지
- 데이터시트 10AX027E4F29E3SG DataSheet
- 재고 있음2693
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Series | Arria 10 GX |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 270000 |
| Total RAM Bits | 17870848 |
| Number of I/O | 360 |
| Voltage - Supply | 0.87V ~ 0.98V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 780-BBGA, FCBGA |
| Supplier Device Package | 780-FBGA, FC (29x29) |
| Number of LABs/CLBs | 101620 |
개요
Description
Arria 10 FPGAs are known for their flexibility and scalability, enabling customization according to specific design requirements. The 10AX027E4F29E3SG includes hardened floating-point DSP blocks, which are beneficial for applications requiring intensive mathematical operations. Additionally, it supports Intel’s Hyperflex FPGA Architecture, enhancing performance through improved clock management and pipeline execution.
Moreover, the Arria 10 series supports a wide range of interfaces and protocols, ensuring compatibility and ease of integration into existing systems. It is typically used in applications that require a balance of performance, power efficiency, and cost, making it suitable for both high-end and mid-range markets.
Features
1. High Performance: Stratix 10 FPGAs utilize Intel's HyperFlex™ architecture, offering significant performance improvements.
2. Advanced Packaging: It includes advanced packaging technology for optimized system-in-package configurations.
3. Transceiver Capabilities: Offers high-speed transceivers suitable for high-bandwidth applications.
4. Power Efficiency: Designed for power efficiency, balancing performance and energy consumption.
5. Integration: Incorporates heterogeneous integration capabilities, including processors and other components within the FPGA.
6. Memory: High memory bandwidth with integrated HBM (High Bandwidth Memory) interfaces.
7. Security: Embedded security features for data and intellectual property protection.
8. Development Tools: Supported by Intel's advanced development tools for design and implementation.
9. Applications: Ideal for applications in data centers, communication networks, and high-performance computing.
These features make the 10AX027E4F29E3SG suitable for a variety of high-demand applications requiring customizable and scalable solutions.
Package
Pinout
In terms of pin count, the 10AX027E4F29E3SG comes in a 29 mm x 29 mm FineLine BGA (Ball Grid Array) package with 1152 pins. The functions of these pins include:
1. IO Pins: For input and output operations, supporting various signaling standards.
2. Power Pins: For supplying core, IO, and auxiliary power voltages.
3. Ground Pins: To provide a return path for current and to minimize electromagnetic interference.
4. Configuration Pins: For device programming and configuration, supporting JTAG and other configuration schemes.
5. Clock Pins: Dedicated pins for clock input to synchronize operations within the FPGA.
Each pin has a specific role in ensuring the device operates correctly according to the application requirements. The exact pin functions are detailed in the device’s datasheet and reference manual provided by Intel.
Manufacturer
Application
Equivalent
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
Payment Methods
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