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AS4C1G16D4-062BCN

Name: AS4C1G16D4-062BCN
Rating: 4.7 (12 reviews)

IC DRAM 16GBIT PARALLEL 96FBGA

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Mfr.부분 #AS4C1G16D4-062BCN
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사양

Part Status	Active
Base Product Number	AS4C1G16
DigiKey Programmable	Not Verified
Memory Type	Volatile
Memory Format	DRAM
Technology	SDRAM - DDR4
Memory Size	16Gbit
Memory Organization	1G x 16
Memory Interface	Parallel
Clock Frequency	1.6 GHz
Write Cycle Time - Word, Page	15ns
Voltage - Supply	1.14V ~ 1.26V
Operating Temperature	0°C ~ 95°C (TC)
Mounting Type	Surface Mount
Package	96-TFBGA
Supplier Device Package	96-FBGA (9x13)
Packaging	Tray
Access Time	19 ns

개요

Description

AS4C1G16D4-062BCN is a memory device part number (AS4C family). In these codes:
- AS4C = memory family
- 1G = 1 Gbit density
- 16 = data width (often 16-bit)
- D4 = organization/technology (often x4)
- 062 = speed grade or timing/process indicator
- BCN = packaging/grade
The exact type (DRAM vs. NAND flash), voltage, timings, and package depend on the vendor’s datasheet. It’s used as a memory component in devices, for data storage or as system RAM/flash. For a precise introduction with specs, please share the vendor or a link to the datasheet.

Features

AS4C1G16D4-062BCN looks like a NAND flash device (exact features depend on the vendor/datasheet). If it is a 1 Gbit x16 device, typical features include:
- Density: ~1 Gbit per die with a 16-bit I/O interface
- NAND type: MLC (multi-level cell)
- Page size: commonly 2 KB (with a spare area of 64–128 bytes); some variants use 4 KB pages
- Interface: ONFI-compatible (revision varies by part)
- Supply/IO: standard flash voltages (often 3.3 V I/O, with device core supply per datasheet)
- Error handling: ECC via host/controller (often BCH), with bad-block management
- Performance features: multi-plane operations, cache/copy-back, read/write streaming
- Endurance: typical program/erase (P/E) cycles in the low thousands per block
- Temperature range: industrial options available (e.g., -40°C to 85°C in many parts)
Notes:
- Exact timings, voltage levels, page size, ECC strength, and endurance depend on the manufacturer and revision. Provide the datasheet for precise specs.

Package

62-ball BGA package (BGA-62).

Pinout

- Pin count: 96 pins (96-ball BGA)
- Function: DDR3 SDRAM device, density 1 Gb, organization x16 (1Gbit, 16-bit data width) with a standard DDR3 interface (CK/CK#, CS#, CKE, RAS#, CAS#, WE#, BA0–BA2, A0–A12, DQ0–DQ15, DQS, DM, Vcc/Vss). Used as a memory device on modules requiring a 16-bit data path.

Manufacturer

- Manufacturer: Alliance Memory, Inc.
- Company type: A semiconductor memory company (fabless), designing and selling memory solutions such as SRAM/DRAM/PSRAM for embedded and consumer applications.