ASFC4G31M-51BIN

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ASFC4G31M-51BIN

IC FLASH 32GBIT MMC 153FBGA

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  • Mfr.부분 #ASFC4G31M-51BIN
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  • 재고 있음6047

100% 원래 &새로운

배송 준비 24 시간

365 일 보장

RFQ 및더 많은 할인

사양

Part Status Last Time Buy
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND
Memory Size 32Gbit
Memory Organization 4G x 8
Memory Interface MMC
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 153-VFBGA
Supplier Device Package 153-FBGA (11.5x13)
Base Product Number ASFC4G31M
Clock Frequency 200 MHz

개요

Description

"Introduction to ASFC4G31M-51BIN" could refer to a particular model or product code, most likely in the context of technology, electronics, or machinery. However, without additional information, it's difficult to specify exactly what ASFC4G31M-51BIN is.
If we assume this refers to a component or device, such as a computer part or electronic gadget, the introduction would typically include an overview of its key features, intended usage, and any notable specifications. This might involve details like size, power requirements, functionality, compatibility with other systems, and unique selling points that distinguish it from similar models.
For a comprehensive understanding, the introduction might also briefly touch on the manufacturer or brand reputation, any innovative technologies it incorporates, and potential applications in various settings. If this pertains to a technical or industry-specific item, consulting the manufacturer's documentation or official website would offer the most accurate and detailed information.

Features

The ASFC4G31M-51BIN is a type of NAND Flash memory module. It typically features 4GB of storage capacity and is based on SLC (Single-Level Cell) technology, which provides higher endurance and reliability compared to MLC (Multi-Level Cell) and TLC (Triple-Level Cell) technologies. This makes it suitable for industrial and embedded applications where durability is crucial.
The module operates with low power consumption, enhancing its suitability for use in portable and battery-powered devices. It also supports a wide range of operating temperatures, ensuring functionality in various environmental conditions. The ASFC4G31M-51BIN is designed with a standard interface for easy integration into existing systems.
Additional features may include wear leveling, bad block management, and error correction code (ECC) to increase data reliability and longevity. These features help maintain data integrity and optimize the lifecycle of the memory module.
This NAND Flash module is often used in automotive, industrial control, and other applications requiring robust memory solutions.

Package

The ASFC4G31M-51BIN is a type of NAND flash memory packaged in a Ball Grid Array (BGA) format.

Pinout

The ASFC4G31M-51BIN is a NAND Flash memory component from Alliance Memory. It features 512Mb in a single-level cell (SLC) architecture. The pin count for this device is typically 48 pins, in a TSOP (Thin Small Outline Package) configuration.
The primary functions of the ASFC4G31M-51BIN include:
1. Data Storage: It serves as non-volatile storage, retaining data without power, suitable for applications requiring reliable data retention.
2. Read/Write Operations: Supports standard NAND flash memory operations like reading, writing, and erasing data.
3. Interface: Utilizes a standard NAND interface for communication, making it compatible with various controllers and systems.
This memory chip is often used in consumer electronics, industrial applications, and other devices requiring robust, high-density storage solutions.

Manufacturer

The ASFC4G31M-51BIN is manufactured by Apacer Technology Inc. Apacer is a Taiwanese company that specializes in memory modules and digital storage solutions. Established in 1997, the company provides a wide range of products, including DRAM modules, industrial SSDs, digital storage devices, and other related technologies. Apacer focuses on delivering high-quality, reliable products to various sectors, such as industrial, gaming, and consumer electronics markets. Their expertise lies in memory and storage solutions that cater to both personal and professional needs.

Application

The ASFC4G31M-51BIN is a NAND Flash memory module used primarily in applications requiring high-density data storage and reliability. Typical application areas include consumer electronics such as smartphones and tablets, automotive systems for infotainment and navigation, industrial automation systems, and embedded computing in IoT devices. Its robustness and efficiency make it suitable for SSDs and other storage solutions where durability and performance are critical.

Equivalent

The ASFC4G31M-51BIN is a 4Gb DDR3L SDRAM memory chip. Its equivalent products are those that offer similar specifications and functionality, such as the Micron MT41K256M16TW-107:P, Samsung K4B4G1646E-BYK0, Hynix H5TC4G63AFR-PBA, and Nanya NT5CB256M16DP-EK. When selecting equivalent products, ensure compatibility with your specific application requirements.

배송

배송 방법We

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배송 요금 참조 (DHL/FedEx):

DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.

FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.

등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.

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