BCM43694B1IRFBG

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BCM43694B1IRFBG

IC RF TXRX WIFI 802.11AX

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배송 준비 24 시간

365 일 보장

RFQ 및더 많은 할인

사양

Part Status Active
DigiKey Programmable Not Verified
Type TxRx Only
RF Family/Standard WiFi
Protocol 802.11ax
Modulation 1024QAM
Data Rate (Max) 4.8Gbps
Packaging Tray

개요

Description

The BCM43694B1IRFBG is a model of a wireless network chip developed by Broadcom. It is designed to support high-performance Wi-Fi connectivity, typically used in consumer electronics such as smartphones, tablets, laptops, and other wireless devices. This chip may support advanced Wi-Fi standards like Wi-Fi 5 or Wi-Fi 6, providing enhanced speed, range, and reliability.
Key features likely include multiple-input and multiple-output (MIMO) technology, which improves data throughput and network capacity, as well as beamforming, which enhances signal strength and range. It may also support features like MU-MIMO (multi-user MIMO) for improved performance in environments with multiple connected devices. These capabilities make the BCM43694B1IRFBG suitable for handling demanding applications like streaming, gaming, and large file transfers.
The "IRFBG" in the model name typically refers to specific packaging and operational details such as temperature range or pin configuration, relevant to manufacturers and engineers integrating the chip into devices. Overall, the BCM43694B1IRFBG represents a component of modern networking hardware necessary for fast and efficient wireless communication.

Features

The BCM43694B1IRFBG is a Wi-Fi system-on-chip (SoC) commonly used in networking devices to deliver high-performance wireless connectivity. Here are its key features:
1. Wi-Fi Standards: Supports IEEE 802.11ac Wave 2, providing high-speed wireless connectivity and improved network efficiency.
2. Multi-User MIMO: Features Multi-User, Multiple Input, Multiple Output (MU-MIMO) technology, allowing simultaneous communication with multiple devices, enhancing overall network performance.
3. Dual-Band Support: Operates on both 2.4GHz and 5GHz bands, offering flexibility and reduced interference for better network management.
4. High Throughput: Capable of delivering data rates up to several Gbps, suitable for high-bandwidth applications like streaming and gaming.
5. Advanced Security: Incorporates robust security protocols, including WPA3, to ensure secure wireless communication.
6. Integration and Efficiency: Offers integrated components that simplify design and improve power efficiency, ideal for consumer electronics and enterprise solutions.
7. Beamforming Technology: Enhances signal range and reliability by directing signals towards specific devices.
These features make the BCM43694B1IRFBG a versatile choice for modern Wi-Fi applications, providing fast, reliable, and secure wireless connectivity.

Package

The BCM43694B1IRFBG is a Broadcom chip typically used in wireless communication applications. It is packaged in a highly integrated System-on-Chip (SoC) format, designed to support Wi-Fi functionalities. The package type is often a fine-pitch Ball Grid Array (BGA), which allows for compact integration on circuit boards.

Pinout

The BCM43694B1IRFBG is a Broadcom wireless LAN SoC commonly used in mobile and consumer electronics devices. It typically supports functions such as Wi-Fi and Bluetooth connectivity. However, specific details like pin count and exact functions can vary depending on the package and the specific implementation of the chip. For precise pin count and function details, you should refer to the chip's datasheet or technical documentation provided by Broadcom or the device manufacturer. Access to such documents often requires an NDA or direct contact with the manufacturer, as detailed information might not be publicly available.

Manufacturer

The BCM43694B1IRFBG is manufactured by Broadcom Inc. Broadcom is a global technology company that designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions. Their products predominantly serve the data center, networking, software, broadband, wireless, and storage markets. Broadcom is known for its innovation in semiconductors and embedded processors, providing critical components for various industries, including telecommunications, industrial, and automotive sectors.

Application

The BCM43694B1IRFBG is a Wi-Fi/Bluetooth combo chip primarily used in wireless communication applications. Its primary applications include smartphones, tablets, laptops, and other consumer electronics requiring robust Wi-Fi and Bluetooth connectivity. Additionally, it can be employed in smart home devices, IoT applications, and automotive infotainment systems, enhancing wireless communication and data exchange capabilities.

Equivalent

The BCM43694B1IRFBG is a Wi-Fi chip by Broadcom typically used for wireless connectivity. Equivalent products could include chips from other manufacturers with similar specifications, such as the Qualcomm QCA9880 or QCA9990, and the MediaTek MT7615. These alternatives provide comparable performance in terms of Wi-Fi standards, frequency bands, and throughput capabilities. When selecting an equivalent, consider specific requirements like form factor, power consumption, and integration compatibility.

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DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.

FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.

등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.

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