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BCM47623A1KFEBG
Broadcom Limited
- 제조업체
- Mfr.부분 #BCM47623A1KFEBG
- 패키지
- 데이터시트
- 재고 있음9170
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
개요
Description
Key features of BCM47623 include low power consumption, advanced signal processing capabilities, and a compact form factor. It offers fast time-to-first-fix (TTFF) and robust performance in challenging environments, such as urban canyons or dense forests. The device is typically used in applications where precise location tracking is critical, ensuring seamless connectivity and functionality in various consumer and industrial products.
Overall, BCM47623A1KFEBG is an efficient solution for integrating GPS functionality into modern devices, catering to the growing demand for accurate location services.
Features
1. Multi-Constellation Support: It supports GPS, GLONASS, Galileo, and BeiDou, enhancing positioning accuracy and reliability.
2. High Sensitivity: It is designed for high sensitivity, enabling operation in challenging environments with weak signals, such as urban canyons and indoors.
3. Low Power Consumption: The chip is optimized for low power usage, making it suitable for battery-operated devices, including wearables and IoT applications.
4. Integrated RF Front-End: The chip includes an integrated RF front-end that simplifies design and reduces component count.
5. Compact Size: Its small form factor allows for easy integration into various devices without consuming significant space.
6. Real-Time Kinematics (RTK): Support for RTK provides centimeter-level accuracy for applications requiring precise positioning.
These features make the BCM47623A1KFEBG suitable for a wide range of applications, including automotive, mobile devices, and industrial systems.
Package
Pinout
The functions of the BCM47623 include:
- Multi-constellation support: It can process signals from GPS, GLONASS, Galileo, and BeiDou.
- High sensitivity: It supports advanced tracking algorithms for enhanced performance in challenging environments.
- Low power consumption: Designed for battery-operated devices, it offers efficient power management.
- Integrated RF front end: It simplifies design by integrating necessary RF components within the chip.
- Interfacing: Supports various communication interfaces, including I2C and SPI for easy integration with microcontrollers and other peripherals.
This chip is commonly used in applications like smartphones, wearables, automotive navigation, and IoT devices.
Manufacturer
Application
Equivalent
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
Payment Methods
지불 기간은 100% 사전 지불입니다.
현재, 우리는 아래 지불 방법만 받아들입니다.:
1. PayPal
2. 신용/직불 카드
3. 전선 전송
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