BCM89230B2BCFBG

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BCM89230B2BCFBG

Broadcom Limited

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  • Mfr.부분 #BCM89230B2BCFBG
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사양

개요

Description

The BCM89230B2BCFBG is a highly integrated Bluetooth and Wi-Fi combo chip developed by Broadcom, designed for use in mobile devices and Internet of Things (IoT) applications. This SoC (System on Chip) supports advanced Bluetooth standards, providing high data rates and low power consumption, making it suitable for applications requiring efficient wireless communication.
The chip typically features integrated power management, RF components, and support for multiple wireless protocols, enabling seamless connectivity for devices such as smartphones, tablets, wearables, and smart home products. It can handle audio streaming, data transfer, and remote control functionalities, enhancing user experiences in various applications.
Key specifications may include support for Bluetooth 5.0 or higher and Wi-Fi standards like 802.11ac, offering improved range and speed. The BCM89230B2BCFBG is optimized for low latency and high security, catering to the growing demands for reliable wireless connections in a connected world. Overall, it represents a versatile solution for developers looking to integrate robust wireless capabilities into their products.

Features

The BCM89230B2BCFBG is a Bluetooth Low Energy (BLE) system-on-chip (SoC) designed by Broadcom for IoT applications. Key features include:
1. Bluetooth 5.0 Support: Provides enhanced data rates and longer range for connectivity.
2. Low Power Consumption: Optimized for battery-operated devices, ensuring extended operational life.
3. Integrated RF Transceiver: Combines RF and baseband functions in a single chip for compact designs.
4. Microcontroller: Includes an ARM Cortex-M4 core for processing capabilities, allowing for application development on-chip.
5. Memory: Sufficient RAM and flash memory to support various applications and enable firmware updates.
6. Peripheral Interfaces: Supports multiple interfaces such as I2C, SPI, and UART, facilitating integration with sensors and other devices.
7. Security Features: Built-in security measures to ensure data integrity and secure connections.
8. Development Support: Compatible with various development tools and platforms, enabling easier prototyping and implementation.
This combination of features makes the BCM89230B2BCFBG suitable for a wide range of smart devices, wearables, and home automation applications.

Package

The BCM89230B2BCFBG is packaged in a 64-pin QFN (Quad Flat No-lead) form factor. This compact package design is suitable for applications requiring a small footprint and efficient thermal performance.

Pinout

The BCM89230B2BCFBG is a System-on-Chip (SoC) designed primarily for Bluetooth and wireless communication applications. It features a total of 128 pins.
The primary functions of these pins include:
- Power Supply: VDD and GND pins for power and ground connections.
- Communication Interfaces: Pins for various communication protocols such as SPI, I2C, UART, and GPIO for interfacing with other devices and peripherals.
- RF Interfaces: Pins dedicated to RF signal transmission and reception, essential for wireless communication.
- Reset and Boot Configuration: Pins that manage reset functions and boot configurations.
- Analog and Digital Interfaces: Pins for ADC/DAC, if applicable, for handling analog signals.
The versatility of the pin configurations allows the BCM89230B2BCFBG to be integrated into a wide range of Bluetooth-enabled applications, including IoT devices, wearables, and other wireless communication systems. Always refer to the specific datasheet for detailed pin functions and specifications.

Manufacturer

The BCM89230B2BCFBG is manufactured by Broadcom Inc., a global technology company that specializes in semiconductor and infrastructure software solutions. Broadcom develops a wide range of products, including networking, broadband, enterprise storage, and wireless communication technologies. The company is known for its innovation in the fields of connectivity and networking, serving various industries such as telecommunications, data centers, and consumer electronics. Broadcom was formed through a series of mergers and acquisitions, including the significant acquisition of Brocade Communications Systems and CA Technologies. It is headquartered in San Jose, California, and is publicly traded on the NASDAQ under the ticker symbol AVGO.

Application

The BCM89230B2BCFBG is a Bluetooth Low Energy (BLE) and Bluetooth Classic SoC, primarily used in wireless audio applications, smart wearables, health and fitness devices, and IoT products. It supports high-quality audio streaming, voice processing, and has applications in automotive connectivity, home automation, and smart appliances, enabling seamless communication and control in various consumer electronics.

Equivalent

The BCM89230B2BCFBG chip, part of Broadcom's Bluetooth and Wi-Fi combo solutions, may have equivalent products like the Qualcomm QCA9377, Cypress CYW4354, or MediaTek MT7635. However, specific compatibility can vary based on application requirements, so it's essential to review their specs and features for a precise match.

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EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.

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