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BGA614H6327XTSA1
IC RF AMP CDMA 2.4GHZ SOT343-4
- 제조업체
- Mfr.부분 #BGA614H6327XTSA1
- 패키지 SC-82A, SOT-343
- 데이터시트
- 재고 있음4736
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Supplier | Infineon Technologies |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Active |
| Frequency | 0Hz ~ 2.4GHz |
| P1dB | 12dBm |
| Gain | 19dB |
| NoiseFigure | 2.1dB |
| RFType | CDMA, GSM, PCS |
| TestFrequency | 1GHz |
| MountingType | Surface Mount |
| Package/Case | SC-82A, SOT-343 |
개요
Description
That exact part number isn’t publicly documented in major catalogs. “BGA614H6327XTSA1” looks like a BGA-packaged RF/mixed-signal IC with a vendor-specific suffix, possibly a regional or custom variant. Without a datasheet, I can’t provide a reliable introduction (function, specs, pinout, or applications).
If you can share the manufacturer or a link to the datasheet, I’ll give a concise intro covering:
- the device function (e.g., LNA, mixer, switch, RF front-end, etc.)
- key electrical specs (frequency range, gain, noise figure, power, supply)
- package and pinout
- typical applications and evaluation guidance
If you can share the manufacturer or a link to the datasheet, I’ll give a concise intro covering:
- the device function (e.g., LNA, mixer, switch, RF front-end, etc.)
- key electrical specs (frequency range, gain, noise figure, power, supply)
- package and pinout
- typical applications and evaluation guidance
Features
I don’t have the exact datasheet for BGA614H6327XTSA1 in memory. Please share the manufacturer or a datasheet link, and I’ll provide concise features. Once I have it, I’ll list: operating frequency range, gain, noise figure, P1dB, IP3, bias/supply requirements, quiescent current, package type, temperature range, ESD protection, and typical applications.
Package
BGA614H6327XTSA1 uses a BGA (Ball Grid Array) package.
Pinout
- Pin count: 614 pins (BGA614 package).
- Function: The package code itself does not define the device function; it only specifies the 614-ball BGA package. The actual function depends on the silicon die inside (e.g., MCU/SoC/FPGA). To know the function, you need the specific device part number or datasheet.
- Function: The package code itself does not define the device function; it only specifies the 614-ball BGA package. The actual function depends on the silicon die inside (e.g., MCU/SoC/FPGA). To know the function, you need the specific device part number or datasheet.
Application
Typical application areas of BGA614H6327XTSA1:
- Broadband RF front-end blocks for wireless transceivers (cellular, Wi‑Fi/Bluetooth, IoT)
- RF receiver/transmitter modules in handheld devices and gateways
- RF test and measurement equipment and development kits
- GNSS/GPS receiver front-ends and satellite communications
Note: verify with the datasheet for exact operating frequency range and power specs.
- Broadband RF front-end blocks for wireless transceivers (cellular, Wi‑Fi/Bluetooth, IoT)
- RF receiver/transmitter modules in handheld devices and gateways
- RF test and measurement equipment and development kits
- GNSS/GPS receiver front-ends and satellite communications
Note: verify with the datasheet for exact operating frequency range and power specs.
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
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