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CSD95372BQ5MC
POWER STAGE DESIGN FOR DUAL COOL
- 제조업체
- Mfr.부분 #CSD95372BQ5MC
- 패키지 VSON12
- 데이터시트
- 재고 있음6006
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | NexFET™ |
| ProductStatus | Active |
| OutputConfiguration | Half Bridge |
| Applications | Synchronous Buck Converters |
| Interface | PWM |
| LoadType | Inductive |
| Technology | Power MOSFET |
| Current-Output/Channel | 60A |
| Current-PeakOutput | 90A |
| Voltage-Supply | 4.5V ~ 5.5V |
| Voltage-Load | 4.5V ~ 16V |
| OperatingTemperature | -55°C ~ 150°C (TJ) |
| Features | Bootstrap Circuit, Status Flag |
| FaultProtection | Current Limiting, Over Temperature, Shoot-Through, Short Circuit, UVLO |
| MountingType | Surface Mount |
| Package/Case | 12-PowerTFDFN |
개요
Description
The module is often used in applications such as electric vehicle inverters, solar inverters, and industrial motor drives, where efficiency and thermal management are critical. The integration of SiC technology allows for reduced cooling requirements, which can lead to smaller system sizes and lower overall system costs. The half-bridge configuration within the module provides a simplified solution for designing high-efficiency power converters by integrating two MOSFETs and gate drivers, thus reducing component count and complexity.
These features make the CSD95372BQ5MC an excellent choice for engineers looking to optimize performance and reliability in demanding power electronics applications.
Features
1. Integrated MOSFETs and Driver: Combines high-side and low-side MOSFETs with a driver into a single package, optimizing space and reducing design complexity.
2. Compact Package: Comes in a small QFN package, measuring 5mm x 6mm, suitable for space-constrained applications.
3. High Efficiency: Offers high efficiency with low switching losses, suitable for applications requiring efficient power conversion.
4. Current Capability: Supports up to a specific current rating, typically in the range of 60A, depending on thermal conditions.
5. Protection Features: Includes various protection mechanisms, such as over-current protection, under-voltage lockout, and thermal shutdown, ensuring reliability and safety.
6. Fast Switching: Enables high-frequency operation, which helps in reducing the size of external components like inductors and capacitors.
7. Thermal Performance: Designed for improved thermal performance, often with low thermal resistance, facilitating better heat dissipation.
This module is ideal for applications in computing, telecommunications, and other areas requiring efficient power management solutions.
Package
Pinout
Key functions include:
1. High Efficiency: Optimized for high-frequency operation and low power loss.
2. Integrated Driver and MOSFETs: Reduces board space and simplifies design.
3. Protection Features: Includes over-current protection, thermal shutdown, and under-voltage lockout.
4. Fast Switching: Allows for high switching frequencies, improving transient response and reducing the size of output inductors and capacitors.
This power stage is commonly used in applications such as servers, telecom, and computing systems where efficient power conversion is crucial. For exact pin configuration and additional specifications, referring to the datasheet is recommended.
Manufacturer
Application
Equivalent
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
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