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EP3SL150F1152I3N
IC FPGA 744 I/O 1152FBGA
- 제조업체
- Mfr.부분 #EP3SL150F1152I3N
- 패키지
- 데이터시트 EP3SL150F1152I3N DataSheet
- 재고 있음6489
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Series | Stratix® III L |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 142500 |
| Total RAM Bits | 6543360 |
| Number of I/O | 744 |
| Voltage - Supply | 0.86V ~ 1.15V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA (35x35) |
| Base Product Number | EP3SL150 |
| Number of LABs/CLBs | 5700 |
개요
Description
Key Features:
1. Architecture: Built on a high-performance logic structure with a focus on balancing power efficiency and processing capacity.
2. Density: Offers a large number of logic elements, in this case, around 150,000, which allows for complex designs and computations.
3. I/O Support: Includes multiple I/O standards and high-speed transceivers to support a range of communication protocols.
4. Power Optimization: Incorporates features for dynamic and fine-grained power management, making it suitable for power-sensitive applications.
5. Advanced Design Tools: Supported by Intel's Quartus Prime design software, providing comprehensive tools for development, simulation, and testing.
Applications:
The EP3SL150F1152I3N is suitable for demanding applications like telecommunications, data centers, high-speed computing, and any systems requiring robust data processing and signal management capabilities.
Features
1. Logic Elements: It contains approximately 149,760 logic elements, suitable for complex designs.
2. Embedded Memory: The device provides around 5.8 Mbits of embedded memory, which is useful for data storage and processing.
3. DSP Blocks: It includes 384 18x18 multipliers for digital signal processing tasks, enhancing computational capabilities.
4. I/O Features: The FPGA supports multiple I/O standards with up to 1,152 pins, making it versatile for various interfacing requirements.
5. Transceivers: It features high-speed transceiver blocks for high-bandwidth data transfer.
6. Power Management: Advanced power management features are integrated to optimize power consumption.
7. Process Technology: Built using 65nm process technology, it balances performance and power efficiency.
8. Configuration: The device utilizes SRAM-based configuration, allowing for flexibility and reconfigurability.
9. Temperature Range: It is designed to operate in a commercial temperature range.
These features make the EP3SL150F1152I3N suitable for applications in telecommunications, networking, and other demanding digital processing environments.
Package
Pinout
The functions of the EP3SL150F1152I3N include:
1. Logic Elements: Used for implementing custom logic circuits.
2. Embedded Memory: Provides on-chip memory for data storage and retrieval.
3. DSP Blocks: Optimize performance for digital signal processing applications.
4. High-Speed Transceivers: Allow for rapid data transfer and communication.
5. I/O Pins: Offer flexible interfacing with external devices and systems.
6. Clock Management: Supports various clock inputs for synchronization purposes.
These features make the EP3SL150F1152I3N suitable for a wide range of applications, including telecommunications, data processing, and other high-complexity digital systems.
Manufacturer
Application
Equivalent
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
Payment Methods
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