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EP4SGX230FF35I3N
IC FPGA 564 I/O 1152FBGA
- 제조업체
- Mfr.부분 #EP4SGX230FF35I3N
- 패키지
- 데이터시트 EP4SGX230FF35I3N DataSheet
- 재고 있음2845
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Series | Stratix® IV GX |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 228000 |
| Total RAM Bits | 17544192 |
| Number of I/O | 564 |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA (35x35) |
| Base Product Number | EP4SGX230 |
| Number of LABs/CLBs | 9120 |
개요
Description
Housed in a FineLine BGA (Ball Grid Array) package, the "FF35" specifies its physical dimensions and pin configuration, which is crucial for integrating the component onto circuit boards. The suffix "I3" denotes the industrial temperature range, ensuring reliable operation under a variety of environmental conditions, from -40°C to 100°C, suitable for diverse applications.
Stratix IV FPGAs are often utilized in fields requiring high bandwidth and computational power, such as telecommunications, data centers, and advanced imaging systems. They support high-speed transceivers, extensive memory interfaces, and advanced I/O capabilities, making them versatile for demanding digital applications.
Features
1. Logic Elements (LEs): It contains approximately 230,000 logic elements, providing substantial capacity for complex designs.
2. Transceivers: Features high-speed transceiver blocks, supporting data rates up to 8.5 Gbps, ideal for high-bandwidth applications.
3. Memory Blocks: Includes a large amount of embedded memory, with over 17 Mb of RAM, facilitating efficient data storage and processing.
4. DSP Blocks: Equipped with numerous DSP blocks, enhancing its capability for signal processing applications.
5. I/O Pins: The device offers 744 user I/O pins, allowing for extensive connectivity with other components and systems.
6. Power Efficiency: Built on a low-power 40nm process technology, it is designed to deliver high performance with reduced power consumption.
7. Package: Available in a 1152-pin FineLine BGA package, enabling high-density designs.
These features make the EP4SGX230FF35I3N suitable for a variety of applications, including telecommunications, data centers, and high-performance computing, where high speed, efficient data processing, and extensive connectivity are crucial.
Package
Pinout
The key functions of the EP4SGX230FF35I3N include:
1. Logic Elements: It provides a large number of logic elements for implementing complex digital designs.
2. Transceivers: It includes high-speed transceivers for fast data communication.
3. Memory: It supports embedded memory blocks for data storage.
4. DSP Blocks: It includes digital signal processing blocks that enhance the processing of arithmetic functions.
5. I/O Interfaces: It offers diverse I/O standards and protocols to connect with other components or systems.
6. Clock Management: It features advanced clock management resources for reliable clock distribution.
This combination allows developers to leverage the FPGA for a variety of high-performance applications, including communications, video processing, and other computational tasks.
Manufacturer
Application
Equivalent
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
Payment Methods
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