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FDMC86102
MOSFET N-CH 100V 7A/20A POWER33
- 제조업체
- Mfr.부분 #FDMC86102
- 패키지
- 데이터시트 FDMC86102 DataSheet
- 재고 있음11905
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사양
| Series | PowerTrench® |
| Part Status | Active |
| Base Product Number | FDMC86 |
| FET Type | N-Channel |
| Technology | MOSFET (Metal Oxide) |
| Drain to Source Voltage (Vdss) | 100 V |
| Current - Continuous Drain (Id) @ 25°C | 7A (Ta), 20A (Tc) |
| Drive Voltage (Max Rds On, Min Rds On) | 6V, 10V |
| Rds On (Max) @ Id, Vgs | 24mOhm @ 7A, 10V |
| Vgs(th) (Max) @ Id | 4V @ 250µA |
| Gate Charge (Qg) (Max) @ Vgs | 18 nC @ 10 V |
| Vgs (Max) | ±20V |
| Input Capacitance (Ciss) (Max) @ Vds | 965 pF @ 50 V |
| Power Dissipation (Max) | 2.3W (Ta), 41W (Tc) |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Supplier Device Package | Power33 |
| Package | 8-PowerTDFN |
| Packaging | Cut Tape (CT), Tape & Reel (TR) |
개요
Description
Features
1. Voltage Rating: It typically supports a maximum drain-source voltage (VDS) of around 60V, making it suitable for various power management applications.
2. Current Rating: The device can handle continuous drain current (ID) ratings, often around 45A, which is beneficial for high-power circuits.
3. Low RDS(on): It has a low on-resistance, generally around 10 mΩ at a given gate voltage, reducing power losses during operation.
4. Fast Switching Speed: The FDMC86102 is optimized for quick switching times, which enhances efficiency in applications like DC-DC converters.
5. Thermal Performance: The package design ensures effective heat dissipation, allowing for reliable operation under demanding conditions.
6. Package Type: Available in a compact surface-mount package, facilitating easier PCB integration.
These characteristics make the FDMC86102 ideal for power management, battery management systems, and motor control applications.
Package
Pinout
1. N-Channel MOSFETs: It includes two separate N-channel MOSFETs, ideal for switching applications.
2. High Efficiency: Suitable for DC-DC converters, power management, and load switch applications due to its low on-resistance.
3. Thermal Performance: Designed for high thermal efficiency, enabling better performance in compact applications.
The pin configuration typically includes:
- Source (S) and Drain (D) pins for each MOSFET.
- Gate (G) pins to control the MOSFET operation.
- Common Source and Drain connections provide versatility in circuit design.
For specific pin functions and details, refer to the manufacturer's datasheet.
Manufacturer
Application
Equivalent
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