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K4A4G085WF-BCTD

Name: K4A4G085WF-BCTD
Rating: 4.7 (12 reviews)

FBGA-78 Memory (ICs) RoHS

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Mfr.부분 #K4A4G085WF-BCTD
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재고 있음19234

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100% 원래 &새로운

배송 준비 24 시간

365 일 보장

RFQ 및더 많은 할인

사양

Packaging

FBGA-78

개요

Description

K4A4G085WF-BCTD is a type of DRAM memory chip produced by Samsung. Specifically, it is a 4Gb (gigabits) DDR3 SDRAM module designed for high-performance applications, commonly used in consumer electronics, computing devices, and networking equipment. This memory chip supports data rates up to 1600 MT/s (megatransfers per second) and operates at a voltage of 1.5V, making it suitable for a variety of devices requiring efficient power consumption and processing speed.
The K4A4G085WF-BCTD features a 512MB x 8 memory organization, which allows for significant data storage capacity while maintaining compact form factors essential for modern electronics. Its design adheres to JEDEC standards, ensuring compatibility with other DDR3 components. The chip's advanced architecture provides improved performance and reliability, making it a popular choice in the development of various applications, including smartphones, tablets, and embedded systems.

Features

The K4A4G085WF-BCTD is a memory chip produced by Samsung, primarily a DDR4 DRAM component. Here are its key features:
1. Type: DDR4 SDRAM (Synchronous Dynamic Random-Access Memory).
2. Density: 4 Gigabits (Gb), which equates to 512 Megabytes (MB).
3. Package: Typically available in a compact 78-ball FBGA (Fine Ball Grid Array) package, suitable for space-constrained applications.
4. Data Rate: Supports data rates up to 2400 MT/s (mega-transfers per second), providing efficient performance for a variety of computing tasks.
5. Voltage: Operates at a low voltage of 1.2V, enhancing energy efficiency and thermal performance.
6. Latency: Offers low latency, improving response times in computing applications.
This memory chip is commonly used in smartphones, tablets, and other mobile devices, supporting enhanced multitasking and faster data processing.

Package

The K4A4G085WF-BCTD is a DRAM memory chip packaged in a 78-ball TFBGA (Thin Fine Ball Grid Array) format. This package type is designed for efficient space utilization and thermal performance in electronic devices.

Pinout

The K4A4G085WF-BCTD is a 4Gb (Gigabit) DDR3 SDRAM memory chip featuring a pin count of 78. It is designed for high-performance memory applications, offering a 64-bit data bus width. This DRAM operates at a voltage of 1.5V and supports various data rates, making it suitable for use in computing devices such as laptops, desktops, and servers. The chip's functions include storing data temporarily during processing, facilitating fast access speeds, and efficient power consumption, which is critical for modern electronic devices.

Manufacturer

The K4A4G085WF-BCTD is manufactured by Samsung Electronics, a South Korean multinational conglomerate and one of the largest manufacturers of semiconductor devices globally. Samsung is primarily known for its consumer electronics, including smartphones and televisions, but it also plays a significant role in the semiconductor industry, producing memory chips like DRAM and NAND flash. The company is involved in various sectors such as electronics, home appliances, and telecommunications, making it a key player in both the tech and global market landscapes.

Application

The K4A4G085WF-BCTD is a 4Gb DDR3 SDRAM memory chip, commonly used in various applications such as consumer electronics, mobile devices, laptops, and servers. It supports high-speed data transfer and is suitable for applications requiring efficient data processing and storage, including gaming consoles, automotive systems, and networking equipment. Its compact design also makes it ideal for embedded systems and Internet of Things (IoT) devices.

Equivalent

The K4A4G085WF-BCTD is a 4GB DDR4 DRAM chip. Equivalent products include:
1. K4A4G085WF-BCTF (same specifications, different package)
2. MT40A4G8 (Micron equivalent)
3. H5AN8G8NAFR (SK Hynix equivalent)
Always verify compatibility with specific device requirements before substitution.