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K9F1G08U0C-PCB0

Name: K9F1G08U0C-PCB0
Rating: 4.7 (12 reviews)

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Mfr.부분 #K9F1G08U0C-PCB0
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사양

Manufacturer	Samsung Electro-Mechanics
Package	TSOPI-48

개요

Description

The K9F1G08U0C-PCB0 is a NAND flash memory chip manufactured by Samsung, designed for use in a variety of electronic devices. It features a 1 Gb (gigabit) density, which makes it suitable for applications requiring compact data storage, such as mobile phones, tablets, and embedded systems.
This chip is based on a 2-bit per cell architecture (MLC - Multi-Level Cell), allowing it to store more data in a smaller footprint compared to single-level cell (SLC) NAND. The K9F1G08U0C-PCB0 operates with a supply voltage of 3.3V and supports asynchronous interface protocols for data transfer.
Key features include high-speed read and write capabilities, a robust error correction mechanism, and an endurance rating that typically allows for a significant number of write/erase cycles. Its reliability and performance make it a popular choice in consumer electronics, automotive systems, and industrial applications.

Features

The K9F1G08U0C-PCB0 is a NAND flash memory chip manufactured by Samsung. Key features include:
1. Capacity: 1 Gbit (128 MB).
2. Interface: It utilizes a parallel NAND interface for data transfer.
3. Organization: The memory is organized in a 2048-byte page size with 64 pages per block, providing efficient data management.
4. Access Speed: Offers fast read and program speeds, suitable for various applications.
5. Endurance: Supports a high number of program/erase cycles, typically around 10,000 cycles per block.
6. Data Retention: Designed for long-term data retention, usually around 10 years at 25°C.
7. Low Power Consumption: Features low power modes to extend battery life in portable devices.
8. Applications: Commonly used in mobile devices, consumer electronics, and as storage in embedded systems.
This chip is well-suited for applications requiring reliable, high-density storage solutions.

Package

The K9F1G08U0C-PCB0 is a NAND Flash memory chip packaged in a TSOP (Thin Small Outline Package). This package type is commonly used in various electronic applications for its compact size and efficient thermal management.

Pinout

The K9F1G08U0C-PCB0 is a NAND Flash memory device produced by Samsung. It comes in a 63-ball FBGA (Fine Ball Grid Array) package, with a pin count of 63 balls. The primary functions of this memory include storing data in a non-volatile manner, allowing for multiple program/erase cycles, and offering high-density storage solutions. The device features organization of 1Gb (1 gigabit) of memory, structured in a 8-bit wide format. It utilizes a page size of 2KB and supports various data access modes, making it suitable for applications in consumer electronics, mobile devices, and other embedded systems. The K9F1G08U0C-PCB0 also provides interfaces for data input/output, control signals, and power management.

Manufacturer

The K9F1G08U0C-PCB0 is manufactured by Samsung Electronics, a South Korean multinational conglomerate. Samsung Electronics is a leading company in the electronics industry, specializing in the production of a wide range of products, including semiconductors, consumer electronics, and telecommunications equipment. The K9F1G08U0C-PCB0 is a NAND flash memory chip, primarily used in various electronic devices for data storage. Samsung is renowned for its innovation and technology leadership in the semiconductor sector, being one of the largest manufacturers of memory chips globally.

Application

The K9F1G08U0C-PCB0 is a NAND flash memory chip primarily used in consumer electronics, including smartphones, tablets, and portable media players. It also finds applications in digital cameras, automotive electronics, and embedded systems for data storage and firmware execution. Its compact size and high storage capacity make it suitable for various applications requiring non-volatile memory solutions.

Equivalent

The K9F1G08U0C-PCB0 chip, a NAND flash memory from Samsung, has several equivalent products. Compatible alternatives include Micron MT29F1G08ABAEAWP and Hynix H26M31001GMR. Always verify specifications such as density, package type, and interface to ensure compatibility.