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MT29F2G16ABBEAHC-AIT:E TR
NAND Flash SLC 2G 128MX16 FBGA
- 제조업체
- Mfr.부분 #MT29F2G16ABBEAHC-AIT:E TR
- 패키지
- 데이터시트 MT29F2G16ABBEAHC-AIT:E TR DataSheet
- 재고 있음6727
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Packaging | MouseReel |
| Standard Pack Qty | 1000 |
개요
Description
Operating with a serial interface, this NAND flash supports asynchronous and synchronous modes, providing flexibility in data transfer rates. The chip is built using advanced 3D NAND technology, which improves reliability and endurance compared to traditional planar NAND. It supports features such as wear leveling and bad block management, which are essential for maintaining data integrity over time.
The “-AIT” designator indicates specific temperature and performance characteristics, while “TR” denotes that the product is supplied in tape and reel packaging for automated assembly processes. Overall, this NAND flash memory chip is suitable for applications requiring high-density storage with efficient performance.
Features
1. Density: 2 Gb (Gigabits) capacity.
2. Interface: Supports ONFI (Open NAND Flash Interface) for interoperability with various host controllers.
3. Form Factor: Typically available in a small BGA (Ball Grid Array) package for compact designs.
4. Speed: Offers high read and write speeds, suitable for fast data access and storage.
5. Endurance: Designed for multiple program/erase cycles, enhancing longevity for demanding applications.
6. Power Management: Low power consumption modes to extend battery life in portable devices.
7. Reliability: Incorporates error correction features for data integrity and reliability.
8. Operating Temperature: Supports a wide temperature range, making it suitable for industrial applications.
This chip is ideal for use in consumer electronics, automotive systems, and industrial applications requiring robust and efficient flash memory solutions.
Package
Pinout
1. Data Pins (DQ0-DQ15): These 16 pins are used for data input and output.
2. Command/Address Pins (CMD, ADDR): Pins for command and address input.
3. Chip Enable (CE): Used to enable the chip.
4. Write Protect (WP): Provides write protection functionality.
5. Ready/Busy (R/B): Indicates when the device is ready for the next command.
6. Ground (GND): Provides the ground reference.
7. Power (VCC, VCCQ): Power supply pins for the device.
8. NAND Flash specific pins (RE, WE): Control read and write operations.
This device is commonly used in applications requiring storage solutions such as smartphones, tablets, and other embedded systems.
Manufacturer
Application
Equivalent
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
Payment Methods
지불 기간은 100% 사전 지불입니다.
현재, 우리는 아래 지불 방법만 받아들입니다.:
1. PayPal
2. 신용/직불 카드
3. 전선 전송
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