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MT40A4G4JC-062E:E

Name: MT40A4G4JC-062E:E
Rating: 4.7 (12 reviews)

IC DRAM 16GBIT POD 78FBGA

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Mfr.부분 #MT40A4G4JC-062E:E
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사양

Part Status	Obsolete
Base Product Number	MT40A4G4
DigiKey Programmable	Not Verified
Memory Type	Volatile
Memory Format	DRAM
Technology	SDRAM - DDR4
Memory Size	16Gbit
Memory Organization	4G x 4
Memory Interface	POD
Clock Frequency	1.6 GHz
Write Cycle Time - Word, Page	15ns
Voltage - Supply	1.14V ~ 1.26V
Operating Temperature	0°C ~ 95°C (TC)
Mounting Type	Surface Mount
Package	78-TFBGA
Supplier Device Package	78-FBGA (9x11)
Packaging	Box
Access Time	19 ns

개요

Description

MT40A4G4JC-062E:E is a Micron DDR3 SDRAM memory device. Specifically, it’s a 4‑gigabit density DRAM with a 4‑bit-wide I/O (x4) per die. It’s used as a building block on memory modules (DIMMs/SODIMMs) to assemble wider data paths and higher capacities. The “062E” suffix denotes a particular speed grade and packaging; exact timings, voltage, and thermal specs depend on the grade. Typical DDR3 operation is at about 1.5V (1.35V for DDR3L variants). Applications include servers, desktops, and laptops via memory modules that combine multiple chips. For precise electrical and timing details (capacity per die, timings, voltages, temperature range), consult the MT40A4G4JC-062E:E datasheet from Micron.

Features

Here are the typical features of Micron MT40A4G4JC-062E:E (DDR3 SDRAM device):
- Type: DDR3 SDRAM
- Density/Organization: 4 Gb per die, x4 data width
- Banks: 8 banks
- Burst: Burst length 8
- Voltage: 1.5 V nominal
- Speed grade: supports standard DDR3 speeds (up to around 1066 MT/s; PC3-8500 class; some variants may reach higher per grade)
- JEDEC compliant
- Timing features: standard DDR3 timing with typical CL/RCD/RAS characteristics
- Refresh: on-die self-refresh with ZQ calibration; partial array self-refresh
- Thermal: on-die thermal sensor
- Packaging: standard Micron FBGA (ball grid array) form factor
- Temperature grades: commercial and industrial variants available (e.g., 0°C to 85°C and/or -40°C to 85°C, depending on part variant)
Note: Exact timing, speed, and packaging options depend on the specific lot/grade. For precise specs, consult the official datasheet.

Package

FBGA package – specifically a 63‑ball FBGA package.

Pinout

- Pin count: 96 pins (FBGA-96).
- Function: Micron MT40A4G4JC-062E:E is a DDR3 SDRAM device with a x4 data width (4-bit I/O). It provides standard DDR3 memory interfaces: DQ0–DQ3 data I/O, DQS0–DQS1 data strobes, address pins (A0–A13/14), bank address BA0–BA2, and control signals (CS#, Ras#, Cas#, We#, CKE). Includes power/ground pins (Vcc, Vss) and reference pins (Vref/VrefDQ). Operates at ~1.5V and supports typical DDR3 timing.

Manufacturer

Manufacturer: Micron Technology, Inc.
What kind of company: A US-based multinational semiconductor company that designs and manufactures memory and storage products (DRAM, NAND flash) and related technologies; one of the world’s largest memory manufacturers.

Application

MT40A4G4JC-062E:E is a Micron DDR3L SDRAM device (low-power, high-density). Typical application areas: laptops/notebooks (SODIMM), desktops/entry servers, storage controllers, networking equipment (routers/switches), embedded/industrial systems, and other consumer electronics requiring DDR3L memory.