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MT53E256M32D2DS-046 IT:B
DRAM LPDDR4 8G 256MX32 FBGA DDP
- 제조업체
- Mfr.부분 #MT53E256M32D2DS-046 IT:B
- 패키지
- 데이터시트 MT53E256M32D2DS-046 IT:B DataSheet
- 재고 있음3522
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Packaging | Tray |
| Standard Pack Qty | 1360 |
개요
Description
Key features include a speed grade of 1,600 MT/s (megatransfers per second), which allows for higher bandwidth compared to previous generations, and it operates at a voltage of 1.2V, enhancing energy efficiency. The "IT:B" designation indicates specific temperature and environmental ratings suitable for industrial applications.
This component is widely used in various applications, including servers, networking equipment, and embedded systems, where reliable and fast memory is critical. Its advanced architecture supports features like error correction and enhanced reliability, making it suitable for mission-critical tasks.
Features
1. Density: 256 Megabits (32 Megabytes) per chip.
2. Data Width: 32 bits, suitable for various applications requiring wide data paths.
3. Operating Frequency: Designed for operational speeds up to 2400 MT/s (megatransfers per second).
4. Voltage: Operates at a low voltage of 1.2V, enhancing energy efficiency.
5. Form Factor: Typically in a compact BGA (Ball Grid Array) package, facilitating easy integration into devices.
6. Temperature Range: Industrial grade, supporting a wide temperature range for reliable performance in harsh environments.
7. Features: Includes advanced error correction capabilities (ECC), ensuring data integrity and reliability.
This memory chip is ideal for applications in embedded systems, networking, and industrial environments where performance and stability are critical.
Package
Pinout
The primary functions of the pins include data transfer, command and control signaling, as well as power and ground connections. Key pins include:
- DQs (Data Lines): 32 data pins for bidirectional data transfer.
- DQMs (Data Mask): Used to mask data during writes.
- CLK (Clock): For synchronizing data transfers.
- CS (Chip Select): Indicates when the chip is active.
- RAS, CAS, WE (Row Address Strobe, Column Address Strobe, Write Enable): Control signals for accessing memory rows and columns.
- VDD/VSS (Power/Ground): Supply voltage and ground connections.
This configuration supports high data rates and bandwidth suitable for modern computing environments.
Manufacturer
Application
Equivalent
1. Samsung K4AAG085WE-BCRC
2. Micron MT40A256M32JR-075
3. Hynix H5AN8G6NBJR-UHC
Always verify specifications and compatibility for specific applications before substitution.
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
Payment Methods
지불 기간은 100% 사전 지불입니다.
현재, 우리는 아래 지불 방법만 받아들입니다.:
1. PayPal
2. 신용/직불 카드
3. 전선 전송
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