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MX68GL1G0FHXFI-11G
IC FLASH 1GBIT PARALLEL 64LFBGA
- 제조업체
- Mfr.부분 #MX68GL1G0FHXFI-11G
- 패키지
- 데이터시트
- 재고 있음6491
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Series | MX68GL |
| Part Status | Active |
| Base Product Number | MX68GL1 |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 1Gbit |
| Memory Organization | 128M x 8 |
| Memory Interface | Parallel |
| Write Cycle Time - Word, Page | 110ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 64-LBGA, CSPBGA |
| Supplier Device Package | 64-LFBGA, CSP (11x13) |
| Packaging | Tray |
| Access Time | 110 ns |
개요
Description
I don’t have an official datasheet for MX68GL1G0FHXFI-11G, so here’s a concise, generic intro you can adapt once you confirm the manufacturer and specs.
- What it is: A compact embedded module/SoC designed for IoT and embedded applications, combining processing power, memory, and standard interfaces in a single package.
- Typical features (variant-dependent): processor core, flash/RAM, peripheral interfaces (UART, SPI, I2C, GPIO), and a protocol/firmware stack. Power/input ranges and wireless/wired communication capabilities vary by model.
- Common applications: remote sensing, asset tracking, industrial automation, smart devices, and other connected systems.
- Key considerations to verify: CPU core and speed, memory size, available interfaces, power requirements, operating temperature, certifications (FCC/CE/UL, etc.), and SDK/toolchain support.
- How to get exact intro: locate the official datasheet or product brief from the manufacturer or distributor; confirm the exact variant, revisions, and supported features.
If you share the manufacturer or a link to the datasheet, I can provide a precise, tailored introduction.
- What it is: A compact embedded module/SoC designed for IoT and embedded applications, combining processing power, memory, and standard interfaces in a single package.
- Typical features (variant-dependent): processor core, flash/RAM, peripheral interfaces (UART, SPI, I2C, GPIO), and a protocol/firmware stack. Power/input ranges and wireless/wired communication capabilities vary by model.
- Common applications: remote sensing, asset tracking, industrial automation, smart devices, and other connected systems.
- Key considerations to verify: CPU core and speed, memory size, available interfaces, power requirements, operating temperature, certifications (FCC/CE/UL, etc.), and SDK/toolchain support.
- How to get exact intro: locate the official datasheet or product brief from the manufacturer or distributor; confirm the exact variant, revisions, and supported features.
If you share the manufacturer or a link to the datasheet, I can provide a precise, tailored introduction.
Pinout
I can’t determine the exact pin count and per-pin functions from the model alone. MX68G-series modules come in multiple package variants with different pinouts. Please provide the package type (e.g., LQFP/BGA pin count) or the datasheet.
Typical MX68G module I/O generally includes:
- Power: VCC, GND, EN/RESET
- UART: TX, RX (and sometimes CTS/RTS)
- Interfaces: SPI or I2C pins
- GPIOs: multiple general-purpose pins
- Misc: ADC, PWM outputs, IRQ/LED indicators
For precise pin count and exact pin functions, refer to the MX68GL1G0FHXFI-11G datasheet or the specific package drawing.
Typical MX68G module I/O generally includes:
- Power: VCC, GND, EN/RESET
- UART: TX, RX (and sometimes CTS/RTS)
- Interfaces: SPI or I2C pins
- GPIOs: multiple general-purpose pins
- Misc: ADC, PWM outputs, IRQ/LED indicators
For precise pin count and exact pin functions, refer to the MX68GL1G0FHXFI-11G datasheet or the specific package drawing.
Application
Typical application areas for MX68GL1G0FHXFI-11G (MX68 MCU/SoC module) include:
- IoT devices and smart sensors
- Industrial automation and process control
- Smart meters and energy management
- Automotive/telematics subsystems
- Medical and health-monitoring equipment
- Consumer electronics and home automation
- Data logging and embedded control systems
- IoT devices and smart sensors
- Industrial automation and process control
- Smart meters and energy management
- Automotive/telematics subsystems
- Medical and health-monitoring equipment
- Consumer electronics and home automation
- Data logging and embedded control systems
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
Payment Methods
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현재, 우리는 아래 지불 방법만 받아들입니다.:
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