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S3C6410XH-66
- 제조업체
- Mfr.부분 #S3C6410XH-66
- 패키지
- 데이터시트
- 재고 있음4023
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Manufacturer | Samsung Electro-Mechanics |
| Package | FBGA-424_13X13 |
개요
Description
The S3C6410XH-66 is a system-on-chip (SoC) developed by Samsung, primarily targeted for use in embedded systems and mobile applications. Based on the ARM1176JZF-S core, it offers efficient processing capabilities with support for multimedia functions, making it suitable for smartphones, portable media players, and similar devices.
Key features of the S3C6410XH-66 include integrated hardware for video encoding and decoding, support for 3D graphics with an onboard graphics accelerator, and various connectivity options such as USB, UART, I2C, and SPI. It typically runs at a clock speed of around 667 MHz, which strikes a balance between performance and power consumption, ideal for battery-powered applications.
The chip supports multiple operating systems, including Windows CE and Linux, offering flexibility for developers in terms of software environments. Its design emphasizes low power consumption while maintaining robust performance for multimedia processing, making it a versatile choice in the mid-2000s for affordable, high-performance handheld devices.
Key features of the S3C6410XH-66 include integrated hardware for video encoding and decoding, support for 3D graphics with an onboard graphics accelerator, and various connectivity options such as USB, UART, I2C, and SPI. It typically runs at a clock speed of around 667 MHz, which strikes a balance between performance and power consumption, ideal for battery-powered applications.
The chip supports multiple operating systems, including Windows CE and Linux, offering flexibility for developers in terms of software environments. Its design emphasizes low power consumption while maintaining robust performance for multimedia processing, making it a versatile choice in the mid-2000s for affordable, high-performance handheld devices.
Features
The S3C6410XH-66 is a system-on-chip (SoC) from Samsung designed for mobile and embedded applications. Key features include:
1. Processor: It is powered by an ARM1176JZF-S core, which supports ARMv6 architecture, offering efficient performance for various applications.
2. Clock Speed: The SoC typically operates at up to 667 MHz, providing a balance between performance and power efficiency.
3. Multimedia Support: It includes hardware acceleration for multimedia functions such as video playback and image processing, including support for MPEG-4/H.264 and JPEG.
4. Graphics: Integrated 3D graphics hardware provides support for OpenGL ES 1.1, suitable for entry-level 3D gaming and UI rendering.
5. Memory Interface: It supports various memory types, including DDR SDRAM and NAND flash, offering flexibility in memory configurations.
6. Connectivity: The chip provides a range of connectivity options, including USB, UART, SPI, and I2C interfaces, facilitating easy integration in devices.
7. Display Support: It can drive displays of various resolutions, suitable for handheld devices.
8. Power Management: Advanced power management features help prolong battery life, making it ideal for portable devices.
Overall, the S3C6410XH-66 is designed for multimedia-rich applications in mobile and embedded systems, balancing performance with power efficiency.
1. Processor: It is powered by an ARM1176JZF-S core, which supports ARMv6 architecture, offering efficient performance for various applications.
2. Clock Speed: The SoC typically operates at up to 667 MHz, providing a balance between performance and power efficiency.
3. Multimedia Support: It includes hardware acceleration for multimedia functions such as video playback and image processing, including support for MPEG-4/H.264 and JPEG.
4. Graphics: Integrated 3D graphics hardware provides support for OpenGL ES 1.1, suitable for entry-level 3D gaming and UI rendering.
5. Memory Interface: It supports various memory types, including DDR SDRAM and NAND flash, offering flexibility in memory configurations.
6. Connectivity: The chip provides a range of connectivity options, including USB, UART, SPI, and I2C interfaces, facilitating easy integration in devices.
7. Display Support: It can drive displays of various resolutions, suitable for handheld devices.
8. Power Management: Advanced power management features help prolong battery life, making it ideal for portable devices.
Overall, the S3C6410XH-66 is designed for multimedia-rich applications in mobile and embedded systems, balancing performance with power efficiency.
Package
The S3C6410XH-66 is a Samsung SoC (System on Chip) and its package type is a 451-pin FBGA (Fine-Pitch Ball Grid Array). This packaging allows for a compact design suitable for embedded applications, facilitating efficient electrical performance while minimizing space usage on circuit boards.
Pinout
The S3C6410XH-66 is a microprocessor developed by Samsung, based on the ARM1176JZF-S core. It is part of the Samsung S3C64XX family of System on Chips (SoCs). This particular processor is typically used in mobile and multimedia applications due to its performance capabilities and multimedia support.
Regarding the pin count, the S3C6410XH-66 comes in a 451-pin FBGA (Fine-Pitch Ball Grid Array) package. This configuration supports various functionalities necessary for mobile computing and multimedia processing.
The functions of the S3C6410 include:
1. CPU Functionality: It offers an ARM1176JZF-S core with speeds up to 667 MHz, capable of running advanced operating systems and applications.
2. Multimedia Support: It has hardware accelerators for video and image processing, supporting formats such as MPEG4, H.264, and JPEG.
3. Memory Interface: The processor supports various memory types, including SDRAM, DDR1, and NAND Flash.
4. Peripherals: It includes interfaces for cameras, LCDs, USB, and other peripheral devices.
The processor is suitable for smart devices requiring efficient processing power and multimedia capabilities while maintaining low power consumption.
Regarding the pin count, the S3C6410XH-66 comes in a 451-pin FBGA (Fine-Pitch Ball Grid Array) package. This configuration supports various functionalities necessary for mobile computing and multimedia processing.
The functions of the S3C6410 include:
1. CPU Functionality: It offers an ARM1176JZF-S core with speeds up to 667 MHz, capable of running advanced operating systems and applications.
2. Multimedia Support: It has hardware accelerators for video and image processing, supporting formats such as MPEG4, H.264, and JPEG.
3. Memory Interface: The processor supports various memory types, including SDRAM, DDR1, and NAND Flash.
4. Peripherals: It includes interfaces for cameras, LCDs, USB, and other peripheral devices.
The processor is suitable for smart devices requiring efficient processing power and multimedia capabilities while maintaining low power consumption.
Manufacturer
The S3C6410XH-66 is manufactured by Samsung Electronics. Samsung Electronics is a multinational conglomerate headquartered in South Korea. It is one of the largest technology companies in the world, known for its wide range of products, including semiconductors, consumer electronics, telecommunications equipment, and home appliances. The company is a major player in the global electronics market and is recognized for its innovation and advancements in technology.
Application
The S3C6410XH-66 is a system-on-chip (SoC) designed for mobile and consumer electronics applications. It is used in areas such as smartphones, portable media players, GPS devices, and netbooks due to its integrated ARM11 processor, multimedia capabilities, and power efficiency. The SoC supports video playback, interactive 3D graphics, and high-resolution camera functionalities, making it suitable for multimedia-rich mobile devices.
Equivalent
The S3C6410XH-66 is a Samsung System-on-Chip (SoC) used in mobile and embedded applications. Equivalent products offering similar functionalities might include Texas Instruments OMAP35x series, Qualcomm Snapdragon S1 processors, and Freescale (now NXP) i.MX31 processors. These chips typically support ARM architectures and are designed for multimedia processing, providing similar capabilities in terms of processing power and application support. Specific equivalence can depend on the particular use case and required features such as clock speed, peripheral support, and power consumption.
배송
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배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
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