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SI6968BEDQ-T1-E3
MOSFET 2N-CH 20V 5.2A 8TSSOP
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- Mfr.부분 #SI6968BEDQ-T1-E3
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365 일 보장
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사양
| Series | TrenchFET® |
| Part Status | Obsolete |
| Technology | MOSFET (Metal Oxide) |
| Configuration | 2 N-Channel (Dual) Common Drain |
| FET Feature | Logic Level Gate |
| Drain to Source Voltage (Vdss) | 20V |
| Current - Continuous Drain (Id) @ 25°C | 5.2A |
| Rds On (Max) @ Id, Vgs | 22mOhm @ 6.5A, 4.5V |
| Vgs(th) (Max) @ Id | 1.6V @ 250µA |
| Gate Charge (Qg) (Max) @ Vgs | 18nC @ 4.5V |
| Power - Max | 1W |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Package / Case | 8-TSSOP (0.173", 4.40mm Width) |
| Supplier Device Package | 8-TSSOP |
| Base Product Number | SI6968 |
개요
Description
Key specifications include a maximum drain-source voltage (V_DS) rated at 30V, a continuous drain current (I_D) of up to 60A, and a low R_DS(on) value that minimizes power loss during operation. Its package type allows for effective thermal management, ensuring reliability in demanding environments.
Overall, the SI6968BEDQ-T1-E3 is a robust choice for engineers seeking reliable MOSFETs for high-performance applications.
Features
1. Voltage Rating: It typically has a drain-source voltage (V_DS) rating of 30V, enabling it to handle a variety of power management tasks.
2. Current Rating: It offers a continuous drain current (I_D) of up to 70A, making it suitable for high-current applications.
3. Low R_DS(on): The on-resistance (R_DS(on)) is low, usually around 5.5 mΩ, which minimizes power losses and improves efficiency.
4. Fast Switching Speed: Designed for high-speed switching applications, it enhances performance in power conversion and motor control.
5. Thermal Performance: The device features a low thermal resistance, allowing for effective heat dissipation.
6. Package Type: It comes in a TO-220 package, facilitating easy heat sinking and integration into various circuit designs.
This MOSFET is ideal for applications in power management, DC-DC converters, and motor drives.
Package
Pinout
The pin functions are as follows:
1. Gate1 (G1) - Control input for the first N-channel MOSFET.
2. Drain1 (D1) - Drain terminal for the first MOSFET.
3. Source1 (S1) - Source terminal for the first MOSFET.
4. Gate2 (G2) - Control input for the second N-channel MOSFET.
5. Drain2 (D2) - Drain terminal for the second MOSFET.
6. Source2 (S2) - Source terminal for the second MOSFET.
7. Drain Source Common (D/S Common) - Common connection for the drains or sources.
8. Thermal Pad - For heat dissipation, typically connected to ground.
This configuration allows efficient control of power in electronic circuits.
Manufacturer
Application
Equivalent
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