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THGAF8T1T83BAIR

Name: THGAF8T1T83BAIR
Rating: 4.7 (12 reviews)

IC FLASH 256GBIT UFS 153VFBGA

제조업체
Mfr.부분 #THGAF8T1T83BAIR
패키지 153-VFBGA
데이터시트
재고 있음3331

+BOM은 RFQ는

100% 원래 &새로운

배송 준비 24 시간

365 일 보장

RFQ 및더 많은 할인

사양

Package	Tray
Series	Consumer UFS
ProductStatus	Active
MemoryType	Non-Volatile
MemoryFormat	FLASH
Technology	FLASH - NAND
MemorySize	256Gb (32G x 8)
MemoryInterface	UFS
Voltage-Supply	2.7V ~ 3.6V
OperatingTemperature	-25°C ~ 85°C (TC)
MountingType	Surface Mount
Package/Case	153-VFBGA

개요

Description

THGAF8T1T83BAIR isn’t a recognized term to me. Could you share what it refers to (topic, product, project, dataset, acronym, etc.)? With context I can tailor the intro precisely. In case you need a quick generic template, use this structure:
- What it is: a brief definition of THGAF8T1T83BAIR
- Purpose: the problem it solves or goal
- Core components: key parts or features
- Benefit: value to users or stakeholders
- Audience: who it’s for
- How it works: high-level mechanism or workflow
- Status/Getting started: availability or next steps
Sample skeleton:
“THGAF8T1T83BAIR is a [type of thing] designed to [solve/achieve]. It comprises [X core components] and employs [methods/techniques]. Targeted at [audience], it provides [benefits]. You can [get started/find out more] by [access/contact].”

Package

I’m not sure which device variant you mean. THGAF8T1T83BAIR could belong to different manufacturers. Please share the manufacturer or a datasheet/link. The package type is device-specific (e.g., QFN, LQFP, BGA, DFN).

Application

THGAF8T1T83BAIR seems to be an unrecognized model/part number. Please specify what it is (chemical, device, software, etc.). If it relates to air technology, typical applications include: air filtration/purification, HVAC/building ventilation, environmental monitoring, industrial hygiene, automotive/aerospace air systems, and consumer air-quality devices.