TLSR8250F512ET32

이미지는 참조용만

TLSR8250F512ET32

  • 제조업체Telink
  • Mfr.부분 #TLSR8250F512ET32
  • 패키지
  • 데이터시트
  • 재고 있음12182

100% 원래 &새로운

배송 준비 24 시간

365 일 보장

RFQ 및더 많은 할인

사양

Manufacturer Telink
Package TQFN-32-EP(5x5)

개요

Description

The TLSR8250F512ET32 is a high-performance, ultra-low-power SoC (System on Chip) designed for Internet of Things (IoT) applications. It features a 32-bit ARM Cortex-M0 processor, 512KB of Flash memory, and 64KB of SRAM, making it suitable for complex tasks while maintaining energy efficiency.
The chip supports Bluetooth 5.0, enabling robust wireless communication and connectivity with other devices. Its integrated peripherals include multiple GPIOs, timers, ADCs, and communication interfaces like UART, SPI, and I2C, allowing for versatile connectivity and sensor integration.
The TLSR8250F512ET32 is optimized for applications requiring long battery life, such as smart home devices, wearables, and industrial automation, and is compatible with various development tools and software environments to facilitate rapid prototyping and development. Its compact design and energy efficiency make it a popular choice for developers looking to implement IoT solutions.

Features

The TLSR8250F512ET32 is a versatile System-on-Chip (SoC) designed for low-power wireless applications. Key features include:
1. Microcontroller: It incorporates a powerful ARM Cortex-M0 core with a maximum clock speed of 32 MHz.
2. Memory: The SoC offers 512 KB of Flash memory and 128 KB of SRAM for efficient data storage and processing.
3. Wireless Connectivity: It supports Bluetooth 5.0 and proprietary RF protocols, enabling robust wireless communication.
4. Low Power Consumption: Designed for energy efficiency, it features various low-power modes, making it suitable for battery-operated devices.
5. Integrated Peripherals: Includes ADC, PWM, GPIO, and UART interfaces for versatile application development.
6. Development Tools: Supports various development environments and tools, facilitating easier programming and integration.
7. Applications: Ideal for smart home devices, wearable technology, and IoT solutions, enhancing connectivity and functionality.
These features collectively make the TLSR8250F512ET32 suitable for a wide range of innovative applications in wireless communication.

Package

The TLSR8250F512ET32 is packaged in a QFN (Quad Flat No-lead) format, specifically a 32-pin QFN package. This compact design facilitates efficient thermal management and electrical performance, making it suitable for various IoT applications.

Pinout

The TLSR8250F512ET32 is a low-power Bluetooth SoC (System-on-Chip) with a pin count of 32 pins. It integrates a 32-bit RISC microcontroller, Bluetooth 5.0 connectivity, and various peripherals. The primary functions include:
1. Bluetooth Connectivity: Supports BLE (Bluetooth Low Energy) for wireless communication.
2. Microcontroller: Provides processing power for running applications.
3. Memory: Includes 512KB of flash and 128KB of SRAM for data storage and application code.
4. GPIOs: General-purpose input/output pins for interfacing with external devices.
5. Timers and PWM: For timing and control applications.
6. ADC: Analog-to-Digital Converter for sensor interfacing.
7. UART/SPI/I2C: Serial communication interfaces for peripheral connectivity.
This versatile SoC is ideal for IoT applications requiring low power consumption and efficient wireless communication.

Manufacturer

The TLSR8250F512ET32 is manufactured by Telink Semiconductor, a company specializing in the design and development of innovative wireless communication and IoT solutions. Founded in 2009, Telink focuses on creating low-power, high-performance ICs for applications such as smart home devices, wearables, and industrial automation. The company is recognized for its expertise in Bluetooth, Zigbee, and other wireless technologies, catering primarily to the consumer electronics and Internet of Things markets.

Application

The TLSR8250F512ET32 is a versatile System-on-Chip (SoC) used in various application areas, including smart home devices, wearables, industrial automation, and IoT solutions. It supports wireless communication protocols like Bluetooth and Zigbee, making it suitable for remote monitoring, smart lighting, healthcare devices, and sensor networks. Its low power consumption and integrated features also enable efficient data processing and connectivity in compact designs.

Equivalent

The TLSR8250F512ET32 is a low-power Bluetooth SoC from Telink. Equivalent products include the Nordic nRF52832, Texas Instruments CC2640R2F, and Silicon Labs EFR32BG13. These chips offer similar features such as Bluetooth connectivity, low power consumption, and integrated microcontrollers, making them suitable alternatives for IoT applications. Always check the specific requirements and datasheets for compatibility.

배송

배송 방법We

DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.


배송 요금 참조 (DHL/FedEx):

DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.

FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.

등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.

지불

Payment Methods

지불 기간은 100% 사전 지불입니다.

현재, 우리는 아래 지불 방법만 받아들입니다.:

1. PayPal

2. 신용/직불 카드

3. 전선 전송

비슷한