이미지는 참조용만

W631GG6KB-15

Name: W631GG6KB-15
Rating: 4.7 (12 reviews)

IC DRAM 1GBIT PAR 96WBGA

제조업체
Mfr.부분 #W631GG6KB-15
패키지
데이터시트 W631GG6KB-15 DataSheet
재고 있음5739

+BOM은 RFQ는

100% 원래 &새로운

배송 준비 24 시간

365 일 보장

RFQ 및더 많은 할인

사양

Part Status	Obsolete
Base Product Number	W631GG6
DigiKey Programmable	Not Verified
Memory Type	Volatile
Memory Format	DRAM
Technology	SDRAM - DDR3
Memory Size	1Gbit
Memory Organization	64M x 16
Memory Interface	Parallel
Clock Frequency	667 MHz
Voltage - Supply	1.425V ~ 1.575V
Operating Temperature	0°C ~ 85°C (TC)
Mounting Type	Surface Mount
Package	96-TFBGA
Supplier Device Package	96-WBGA (9x13)
Packaging	Tray
Access Time	20 ns

개요

Description

W631GG6KB-15 appears to refer to a specific model or product code, possibly related to electronics, automotive components, or similar fields. Unfortunately, without additional context, it's difficult to provide a precise introduction or description.
Typically, product codes like W631GG6KB-15 are used to identify specific features, specifications, or variants of a product. If you can provide more context regarding the category or industry related to this code, I would be happy to offer a more tailored introduction or explanation.

Features

The W631GG6KB-15 is a model of DRAM (Dynamic Random Access Memory) module designed primarily for use in computing systems. Key features typically include:
1. Type: DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic RAM).
2. Capacity: 8GB (varies by specific model).
3. Speed: Operates at 1600 MHz (PC3-12800).
4. Form Factor: DIMM (Dual In-line Memory Module).
5. Voltage: Usually operates at 1.5V.
6. Data Rate: Offers high data transfer rates, suitable for multitasking and running memory-intensive applications.
7. Compatibility: Compatible with many motherboards that support DDR3 memory.
This RAM module is ideal for enhancing system performance in desktops and workstations, particularly for applications demanding higher bandwidth and speed.

Package

The W631GG6KB-15 is a memory chip packaged in a 48-ball Fine-Pitch Ball Grid Array (FBGA) format. This package type is designed for high-density applications, providing efficient thermal and electrical performance suitable for mobile and embedded systems.

Pinout

The W631GG6KB-15 is a DRAM memory chip with a pin count of 78. It is a 1Gb (gigabit) DDR3 SDRAM device organized as 128M x 8 bits. The primary functions of this memory chip include data storage and retrieval in various electronic devices. It operates at a supply voltage of 1.5V and features a high-speed data transfer capability, supporting data rates of up to 1600 MT/s (megatransfers per second). Its application typically includes use in computers, graphics cards, and other consumer electronics where fast and efficient memory is required.

Manufacturer

The W631GG6KB-15 is a component manufactured by Winbond Electronics Corporation. Winbond is a Taiwanese semiconductor company known for producing memory and non-memory ICs (integrated circuits). They specialize in manufacturing various types of memory products, including DRAM, Flash memory, and other related semiconductor solutions. Founded in 1987, Winbond has established itself as a key player in the global semiconductor market, serving a wide range of industries such as consumer electronics, telecommunications, and automotive applications. The company's focus on innovation and quality has positioned it as a significant contributor to the advancement of memory technology.

Application

The W631GG6KB-15 is a DDR3 memory chip primarily used in consumer electronics, including laptops, desktops, and tablets. It supports applications requiring high-speed data processing, such as gaming, multimedia editing, and general computing tasks. Additionally, it's suitable for embedded systems and IoT devices that demand efficient memory solutions.

Equivalent

The W631GG6KB-15 chip is a DDR3 SDRAM memory chip. Equivalent products include:
1. MT41K256M16 (Micron)
2. K3AAGF8/16 (Samsung)
3. H5TQ2G83CFR (SK Hynix)
4. IS42S16800B (Integrated Silicon Solution)
Always verify compatibility based on specific application needs and specifications.