W632GU6NB11I

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W632GU6NB11I

IC DRAM 2GBIT PAR 96VFBGA

100% 원래 &새로운

배송 준비 24 시간

365 일 보장

RFQ 및더 많은 할인

사양

Part Status Obsolete
Base Product Number W632GU6
DigiKey Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3L
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface Parallel
Clock Frequency 933 MHz
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.283V ~ 1.45V
Operating Temperature -40°C ~ 95°C (TC)
Mounting Type Surface Mount
Package 96-VFBGA
Supplier Device Package 96-VFBGA (7.5x13)
Packaging Tray
Access Time 20 ns

개요

Description

W632GU6NB11I refers to a specific model of a semiconductor device or integrated circuit, typically identified by a manufacturer's part number. This designation includes a combination of letters and numbers that indicate various technical specifications, such as the type, function, and version of the component.
In general, devices like W632GU6NB11I are used in electronic applications ranging from consumer electronics to industrial machinery. They may serve functions such as memory storage, signal processing, or power management.
To gain detailed information about this specific component, including its datasheet, features, pin configuration, and applications, one would typically refer to the manufacturer's website or technical documentation. This will provide insights into its performance characteristics, electrical specifications, and recommended usage guidelines.

Features

The W632GU6NB11I is a model of industrial-grade wireless communication device designed for various applications. Key features typically include:
1. Wireless Connectivity: Supports Wi-Fi and possibly other wireless protocols such as Bluetooth or Zigbee, facilitating seamless data transmission.

2. Durability: Built to withstand harsh environments, with an industrial-grade design that often includes temperature resistance and rugged casing.
3. Protocols: Compatibility with multiple industrial communication protocols, such as MQTT, Modbus, or TCP/IP, enabling integration with existing systems.
4. Security: Enhanced security features, including encryption and secure access controls, to protect data integrity.
5. Scalability: Supports expansion and integration within larger systems, making it suitable for IoT applications.
6. User Interface: May include an intuitive user interface for configuration and monitoring, often accessible via web or mobile applications.
7. Power Efficiency: Designed to consume low power, making it suitable for battery-operated deployments.
These features make the W632GU6NB11I versatile for various industrial applications, including automation, monitoring, and data collection.

Package

The W632GU6NB11I is a memory chip packaged in a 78-ball FBG (Fine Pitch Ball Grid Array) format. This type of packaging provides efficient thermal performance and compact design suitable for high-density applications.

Pinout

The W632GU6NB11I is a DRAM (Dynamic Random Access Memory) chip with a pin count of 54. It is designed for use in various memory applications, providing high-speed data transfer and efficient power consumption. The primary function of this chip is to store and retrieve data dynamically, which is essential for computer memory in devices like laptops, desktops, and other electronic systems. Its specifications include a DDR3 SDRAM architecture, supporting a data rate of up to 1066 MT/s (megatransfers per second). The chip features a standard organization of 8 bits wide and is available in a 1 Gbit capacity.

Manufacturer

The W632GU6NB11I is manufactured by Winbond Electronics Corporation, a Taiwanese semiconductor company. Winbond specializes in the design and production of memory products, including DRAM and flash memory. Established in 1987, the company focuses on providing innovative solutions for various applications, ranging from consumer electronics to industrial and automotive sectors. Winbond is known for its commitment to quality and technology, developing a range of memory products that meet the diverse needs of its customers worldwide.

Application

The W632GU6NB11I is a DRAM memory chip commonly used in applications such as mobile devices, laptops, and tablets. Its high speed and efficiency make it suitable for gaming, multimedia processing, and demanding computational tasks. Additionally, it can be utilized in various embedded systems and Internet of Things (IoT) devices, enhancing performance and responsiveness in these applications.

Equivalent

The W632GU6NB11I chip is a DDR3 SDRAM memory module. Equivalent products include:
1. W632GU6NB11E - Similar specifications, often with slight variations in temperature range or speed.
2. MT41J256M16HA-125 - Micron alternative with similar timing parameters.
3. Hynix H5TQ2G83AFR - Hynix equivalent with compatible features.
Always check specific datasheets for detailed compatibility and specifications.

배송

배송 방법We

DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.


배송 요금 참조 (DHL/FedEx):

DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.

FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.

등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.

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