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XC3S1200E-4FGG400I
IC FPGA 304 I/O 400FBGA
- 제조업체
- Mfr.부분 #XC3S1200E-4FGG400I
- 패키지 BGA-400
- 데이터시트
- 재고 있음7496
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Package | Tray |
| Series | Spartan®-3E |
| ProductStatus | Active |
| NumberofLABs/CLBs | 2168 |
| NumberofLogicElements/Cells | 19512 |
| TotalRAMBits | 516096 |
| NumberofI/O | 304 |
| NumberofGates | 1200000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 400-BGA |
개요
Description
Key specifications include a 400-ball Fine Pitch Ball Grid Array (FBGA) package, an operating voltage of 1.2V, and a maximum clock speed of around 200 MHz. The FPGA is equipped with enhanced DSP (Digital Signal Processing) capabilities, making it ideal for applications in signal processing, embedded systems, and digital communication.
The XC3S1200E offers a rich set of I/O options, including general-purpose and dedicated high-speed transceivers, alongside a variety of configuration mechanisms. It supports the Xilinx ISE Design Suite for development, enabling users to implement complex functionalities using hardware description languages like VHDL and Verilog. With its balance of performance, power efficiency, and flexibility, the XC3S1200E is widely utilized in industrial, automotive, and consumer electronic applications.
Features
1. Logic Cells: 1,200 logic cells, allowing for efficient implementation of complex designs.
2. I/O Pins: Up to 232 user I/O pins, supporting various voltage standards and configurations.
3. Configurable Logic Blocks (CLBs): Each CLB contains flip-flops and look-up tables, enabling versatile logic functions.
4. Memory: Integrated block RAM of up to 6 Kbits per block, providing on-chip storage.
5. Digital Signal Processing (DSP): Optional DSP slices for high-performance arithmetic operations.
6. Performance: Supports a maximum clock frequency of up to 200 MHz.
7. Power Efficiency: Low power consumption, suitable for battery-operated devices.
8. Package: Available in a 400-ball fine-pitch ball grid array (FBGA) package, facilitating compact designs.
Overall, the XC3S1200E-4FGG400I is ideal for applications requiring moderate complexity with a focus on cost-effectiveness and power efficiency.
Package
Pinout
The device features multiple I/O banks, allowing for a wide range of I/O standards and configurations. The XC3S1200E includes programmable logic, embedded multipliers, and distributed RAM, enabling complex logic functions and high-performance processing capabilities. It also supports various configuration methods, including JTAG and master serial mode, facilitating easy integration into designs.
Overall, the XC3S1200E is well-suited for cost-sensitive applications requiring moderate logic capacity and performance.
Manufacturer
Application
Equivalent
1. Lattice ECP3: ECP3-70 or ECP3-150 FPGAs
2. Altera Cyclone III: EP3C120F484C6
3. Microsemi SmartFusion: M2S050-FGG484
These alternatives vary in specifications, so check compatibility for specific applications.
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
Payment Methods
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