XC3S1400A-4FGG676C

이미지는 참조용만

XC3S1400A-4FGG676C

IC FPGA 502 I/O 676FBGA

  • 제조업체
  • Mfr.부분 #XC3S1400A-4FGG676C
  • 패키지 BGA-676
  • 데이터시트
  • 재고 있음4263

100% 원래 &새로운

배송 준비 24 시간

365 일 보장

RFQ 및더 많은 할인

사양

Package Tray
Series Spartan®-3A
ProductStatus Active
NumberofLABs/CLBs 2816
NumberofLogicElements/Cells 25344
TotalRAMBits 589824
NumberofI/O 502
NumberofGates 1400000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 676-BGA

개요

Description

The XC3S1400A-4FGG676C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A series. Designed for cost-sensitive applications, it offers a balance of performance and power efficiency. The device features 1.4 million system gates, making it suitable for a range of digital logic applications, including communications, automotive, and consumer electronics.
Key specifications include a maximum clock frequency of 300 MHz, up to 48 I/O pins, and various configurations for memory and logic resources. Its architecture supports multiple logic functions, DSP slices for high-speed arithmetic processing, and efficient routing resources.
The XC3S1400A also incorporates advanced features such as Integrated Block RAM (BRAM) and Digital Signal Processing (DSP) capabilities, which enhance its versatility. Programming is accomplished using Xilinx’s ISE Design Suite, enabling developers to implement custom logic designs easily.
Overall, the XC3S1400A-4FGG676C is a reliable choice for integrating customizable hardware solutions in space-constrained environments while maintaining performance and flexibility.

Features

The XC3S1400A-4FGG676C is a Spartan-3A FPGA (Field-Programmable Gate Array) from Xilinx, designed for cost-sensitive applications. Key features include:
- Logic Cells: Up to 1,400 logic cells, providing flexibility for various digital designs.
- I/O Pins: 676 package with up to 576 user-configurable I/O pins, supporting multiple voltage standards.
- Block RAM: 36 Kbits of on-chip Block RAM for data storage and buffering.
- DSP Slices: Contains dedicated DSP slices for efficient digital signal processing.
- High-Speed Performance: Capable of operating at up to 250 MHz, suitable for high-speed applications.
- Power Efficiency: Optimized for low power consumption, making it ideal for battery-operated devices.
- Configuration: Supports multiple configuration modes, including JTAG and SPI.
- Development Tools: Compatible with Xilinx ISE design software for streamlined development and simulation.
This FPGA is suitable for a variety of applications, including telecommunications, automotive, and industrial control systems.

Package

The XC3S1400A-4FGG676C is a Field-Programmable Gate Array (FPGA) packaged in a Fine-Pitch Ball Grid Array (FBGA) with 676 balls. It is designed for high-density applications, providing robust performance and connectivity.

Pinout

The XC3S1400A-4FGG676C is a Spartan-3A FPGA from Xilinx, housed in a Fine-Pitch Ball Grid Array (FBGA) package with 676 balls. The pin count is 676. This FPGA features various I/O standards and can be configured for different applications, including digital signal processing, embedded applications, and complex logic designs. It offers 1,400 logic cells, supports up to 48 dedicated I/O pins, and provides functionalities such as a built-in clock management tile, DSP slices, and memory blocks. The device is suitable for a range of applications, including communication systems, automotive, and industrial control.

Manufacturer

The XC3S1400A-4FGG676C is manufactured by Xilinx, Inc. Xilinx is a leading company in the semiconductor industry, specializing in the development of field-programmable gate arrays (FPGAs), programmable system-on-chips (SoCs), and other related technologies. Founded in 1984, Xilinx pioneered the FPGA market and continues to be a major player in providing solutions for various applications, including telecommunications, automotive, industrial, and data centers. The company focuses on enabling customers to create adaptable and efficient hardware designs, allowing for flexibility and innovation in their electronic systems. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities and market reach in the semiconductor domain.

Application

The XC3S1400A-4FGG676C, a Xilinx Spartan-3 FPGA, is utilized in various applications, including digital signal processing, communications, automotive control systems, industrial automation, and consumer electronics. Its flexibility allows for custom logic implementations, making it suitable for prototyping, embedded systems, and real-time processing tasks. Additionally, it can be used in image processing and video applications due to its capacity for parallel processing.

Equivalent

The XC3S1400A-4FGG676C is a Spartan-3 FPGA from Xilinx. Equivalent products include:
1. XC3S1500A - Slightly more resources.
2. XC3S2000A - Higher performance and capacity.
3. Lattice ICE40 - Alternative low-power FPGA.
4. Altera Cyclone II - Similar performance range.
Always verify specific requirements like I/O count, power consumption, and features when selecting an equivalent.

배송

배송 방법We

DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.


배송 요금 참조 (DHL/FedEx):

DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.

FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.

등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.

지불

Payment Methods

지불 기간은 100% 사전 지불입니다.

현재, 우리는 아래 지불 방법만 받아들입니다.:

1. PayPal

2. 신용/직불 카드

3. 전선 전송