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XC3S1500-4FG676C

Name: XC3S1500-4FG676C
Rating: 4.7 (12 reviews)

IC FPGA 487 I/O 676FCBGA

제조업체
Mfr.부분 #XC3S1500-4FG676C
패키지 676-BGA
데이터시트
재고 있음3100

+BOM은 RFQ는

100% 원래 &새로운

배송 준비 24 시간

365 일 보장

RFQ 및더 많은 할인

사양

Supplier	AMD Xilinx
Package	Tray
Series	Spartan®-3
ProductStatus	Active
NumberofLABs/CLBs	3328
NumberofLogicElements/Cells	29952
TotalRAMBits	589824
NumberofI/O	487
NumberofGates	1500000
Voltage-Supply	1.14V ~ 1.26V
MountingType	Surface Mount
OperatingTemperature	0°C ~ 85°C (TJ)
Package/Case	676-BGA

개요

Description

XC3S1500-4FG676C is a Xilinx Spartan-3S FPGA. It targets cost‑sensitive, mid/high‑density digital logic. The device integrates roughly 1.5 million system gates (LEs), plus distributed RAM blocks, DSP slices, and clock management PLLs. The -4 denotes the speed grade (one of the slower timing variants). The FG676C package is a FineLine BGA with 676 pins, enabling a large number of I/O across several banks and supporting multiple I/O standards. It’s programmed via JTAG or SPI, and designs are created in Xilinx ISE (or older Vivado WebPACK) using HDL (Verilog/VHDL) with constraints in a UCF file. Typical uses include embedded controllers, DSP/data-path processing, custom peripherals, and interface hardware. Note: Spartan-3 is an older family; for new designs consider Spartan-6 or 7-series FPGAs.

Features

XC3S1500-4FG676C is a Xilinx Spartan-3S FPGA (SRAM-based) in a 676-pin FineLine BGA, speed grade -4. Key features:
- 90 nm Spartan-3S architecture with dense LUT-based logic and fast carry logic
- On-chip memory: block RAM (M4K blocks) plus distributed RAM
- DSP capability via dedicated multipliers for signal processing
- Clocking: clock-management with DCMs/PLLs for flexible timing
- I/O: abundant multi-voltage I/O in multiple banks, supporting common standards (LVCMOS/LVTTL, SSTL/HSTL, etc.)
- Reconfigurable, SRAM-based fabric with JTAG boundary-scan
- Suitable for general logic, DSP, data path, and embedded glue logic
- Package: FG676C (676-pin FineLine BGA) for high I/O density and routing
Note: for exact resource counts (logic cells, BRAM, DSP slices) and electrical specs, consult the official Xilinx XC3S1500-4FG676C datasheet.

Package

FineLine BGA package, FG676 (676 balls). The -4FG676C suffix denotes the FG676C variant of the FG676 package.

Pinout

- Pin count: 676 pins (FG676 package)
- Function: Xilinx XC3S1500-4FG676C is a Spartan-3 FPGA (1500 logic cell) in a 676-pin package, a general-purpose, reconfigurable digital logic device with I/O, RAM blocks, multipliers, etc.

Manufacturer

- Manufacturer: Xilinx, Inc. (now part of AMD)
- What kind of company: A multinational semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs and CPLDs, plus related IP, software, and other integrated circuits.

Application

XC3S1500-4FG676C is a Spartan-6 FPGA. Typical applications include:
- Digital signal processing and filtering
- Embedded control and I/O interfaces (motor control, power management, sensors)
- Industrial automation and process control
- Communications and networking interface logic
- Data acquisition, instrumentation and test equipment
- Prototyping, education, and cost-sensitive custom logic
- Low- to mid-range video/image processing and consumer electronics front-end