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XC3S2000-4FGG456C
IC FPGA 333 I/O 456FBGA
- 제조업체
- Mfr.부분 #XC3S2000-4FGG456C
- 패키지 FBGA-456
- 데이터시트
- 재고 있음4037
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Package | Tray |
| Series | Spartan®-3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 5120 |
| NumberofLogicElements/Cells | 46080 |
| TotalRAMBits | 737280 |
| NumberofI/O | 333 |
| NumberofGates | 2000000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 456-BBGA |
개요
Description
Key specifications include:
- Architecture: Spartan-3, known for its low power consumption and cost-effectiveness.
- Logic Cells: Up to 200,000 equivalent logic cells, enabling complex designs.
- I/O Pins: 456 I/O pins, with support for multiple voltage levels and I/O standards.
- Performance: Operates at clock speeds of up to 200 MHz, suitable for high-speed applications.
- Package Type: FGG (Fine Pitch Ball Grid Array) for enhanced thermal performance and reliability.
The XC3S2000 is often used in prototyping and development environments, where flexibility and reconfigurability are essential. Its combination of features makes it a popular choice for varied applications, from simple control systems to more complex digital signal processing tasks.
Features
- Logic Cells: Approximately 2 million system gates and up to 200,000 logic cells.
- I/O Pins: Offers up to 456 user I/O pins, supporting various I/O standards such as LVTTL, LVCMOS, and PCI.
- Memory: Supports up to 128 Kbits of block RAM, enabling efficient data storage and manipulation.
- DSP Slices: Contains dedicated DSP slices for high-performance digital signal processing applications.
- Configuration: Supports multiple configuration methods including JTAG, SPI, and parallel modes.
- Clock Management: Integrated clock management features, including Phase-Locked Loops (PLLs) and clock dividers.
- Power: Operates with a low power consumption profile, making it suitable for battery-powered applications.
- Package: Available in a fine-pitch ball grid array (FBGA) package, providing a compact footprint.
Overall, the XC3S2000-4FGG456C is designed for versatility in various digital logic applications, including communications, automotive, and consumer electronics.
Package
Pinout
Manufacturer
Application
Equivalent
1. Lattice ECP3 - ECP3-70
2. Altera Cyclone III - EP3C20
3. Microsemi SmartFusion - M2S010
4. Lattice MachXO - MachXO2-256
These alternatives vary in features and specifications, so it's important to evaluate specific application requirements.
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
Payment Methods
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현재, 우리는 아래 지불 방법만 받아들입니다.:
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