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XC3S250E-4FT256C
IC FPGA 172 I/O 256FTBGA
- 제조업체AMD
- Mfr.부분 #XC3S250E-4FT256C
- 패키지
- 데이터시트
- 재고 있음5924
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
Series | Spartan®-3E |
Part Status | Obsolete |
DigiKey Programmable | Not Verified |
Total RAM Bits | 221184 |
Number of I/O | 172 |
Number of Gates | 250000 |
Voltage - Supply | 1.14V ~ 1.26V |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Package / Case | 256-LBGA |
Supplier Device Package | 256-FTBGA (17x17) |
Base Product Number | XC3S250 |
Number of Logic Elements/Cells | 5508 |
Number of LABs/CLBs | 612 |
개요
Description
The XC3S250E-4FT256C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3E family, designed for low-cost, high-performance applications. It features 250,000 system gates, making it suitable for various digital designs, including communications, automotive, and consumer electronics.
Key specifications include a 4-input LUT (Look-Up Table) architecture, a maximum clock frequency of up to 200 MHz, and up to 228 user I/O pins. The device supports multiple I/O voltage standards, making it versatile for interfacing with different components.
The XC3S250E is housed in a 256-ball Fine Pitch Ball Grid Array (FBGA) package, facilitating efficient thermal management and PCB space optimization. Its capabilities include programmable logic, digital signal processing, and embedded memory, allowing designers to implement complex algorithms and functions.
Xilinx provides a comprehensive development environment, including the ISE Design Suite, which offers design entry, simulation, and synthesis tools to streamline the development process. Overall, the XC3S250E-4FT256C is an accessible yet powerful choice for a wide range of embedded system applications.
Key specifications include a 4-input LUT (Look-Up Table) architecture, a maximum clock frequency of up to 200 MHz, and up to 228 user I/O pins. The device supports multiple I/O voltage standards, making it versatile for interfacing with different components.
The XC3S250E is housed in a 256-ball Fine Pitch Ball Grid Array (FBGA) package, facilitating efficient thermal management and PCB space optimization. Its capabilities include programmable logic, digital signal processing, and embedded memory, allowing designers to implement complex algorithms and functions.
Xilinx provides a comprehensive development environment, including the ISE Design Suite, which offers design entry, simulation, and synthesis tools to streamline the development process. Overall, the XC3S250E-4FT256C is an accessible yet powerful choice for a wide range of embedded system applications.
Features
The XC3S250E-4FT256C is a member of the Xilinx Spartan-3E FPGA family, designed for cost-sensitive applications. Key features include:
- Logic Cells: 250,000 system gates, providing ample logic resources for moderate complexity designs.
- I/O Pins: Up to 92 I/O pins, supporting various I/O standards including LVTTL, LVCMOS, and PCI.
- Memory: Integrated Block RAM (BRAM) with up to 8 Kb of memory per block, allowing for efficient data storage.
- DSP Slices: Supports digital signal processing applications with dedicated DSP slices.
- Configuration: Supports multiple configuration options, including JTAG and slave serial modes.
- Speed Grade: -4 speed grade, enabling a maximum performance of up to 400 MHz.
- Power Consumption: Low power operation, crucial for battery-operated or energy-sensitive applications.
- Development Tools: Compatible with Xilinx ISE design suite for easy development and implementation.
These features make the XC3S250E-4FT256C ideal for a variety of applications, including consumer electronics, automotive systems, and industrial automation.
- Logic Cells: 250,000 system gates, providing ample logic resources for moderate complexity designs.
- I/O Pins: Up to 92 I/O pins, supporting various I/O standards including LVTTL, LVCMOS, and PCI.
- Memory: Integrated Block RAM (BRAM) with up to 8 Kb of memory per block, allowing for efficient data storage.
- DSP Slices: Supports digital signal processing applications with dedicated DSP slices.
- Configuration: Supports multiple configuration options, including JTAG and slave serial modes.
- Speed Grade: -4 speed grade, enabling a maximum performance of up to 400 MHz.
- Power Consumption: Low power operation, crucial for battery-operated or energy-sensitive applications.
- Development Tools: Compatible with Xilinx ISE design suite for easy development and implementation.
These features make the XC3S250E-4FT256C ideal for a variety of applications, including consumer electronics, automotive systems, and industrial automation.
Package
The XC3S250E-4FT256C is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically a 256-ball package. This type of package provides a compact design with efficient thermal and electrical performance, suitable for various applications in FPGA designs.
Pinout
The XC3S250E-4FT256C is a Spartan-3E FPGA from Xilinx with a total of 256 pins. It features a range of functions including digital signal processing, logic implementation, and various I/O capabilities.
Key specifications include:
- Pin Count: 256
- Logic Cells: 250,000
- Block RAM: 4 Kbits
- I/O Pins: Configurable to accommodate different voltage levels and signaling standards.
- Package Type: Fine-pitch BGA (Ball Grid Array)
The device supports multiple I/O standards, enabling connectivity to different peripherals and integration into diverse applications, such as communications, automotive, and consumer electronics. The XC3S250E is suitable for low-power and cost-sensitive designs while providing flexibility in hardware configuration.
Key specifications include:
- Pin Count: 256
- Logic Cells: 250,000
- Block RAM: 4 Kbits
- I/O Pins: Configurable to accommodate different voltage levels and signaling standards.
- Package Type: Fine-pitch BGA (Ball Grid Array)
The device supports multiple I/O standards, enabling connectivity to different peripherals and integration into diverse applications, such as communications, automotive, and consumer electronics. The XC3S250E is suitable for low-power and cost-sensitive designs while providing flexibility in hardware configuration.
Manufacturer
The manufacturer of the XC3S250E-4FT256C is Xilinx, Inc. Xilinx is a semiconductor company known for pioneering field-programmable gate array (FPGA) technology. Founded in 1984 and headquartered in San Jose, California, Xilinx specializes in programmable logic devices, including FPGAs, complex programmable logic devices (CPLDs), and system-on-chip (SoC) solutions. The XC3S250E-4FT256C is part of the Spartan-3E FPGA family, designed for cost-sensitive applications requiring high performance and flexibility. Xilinx focuses on a variety of markets, including data centers, automotive, aerospace, telecommunications, and industrial applications. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its influence in the semiconductor industry.
Application
The XC3S250E-4FT256C is a low-cost FPGA from Xilinx, commonly used in applications such as digital signal processing, embedded systems, telecommunications, industrial automation, and consumer electronics. Its versatility allows for custom hardware acceleration, prototyping, and interfacing in applications like robotics, automotive systems, and networking equipment.
Equivalent
The XC3S250E-4FT256C is a Spartan-3E FPGA from Xilinx. Equivalent products include the LatticeECP2M, Altera Cyclone II, and Intel MAX 10 FPGAs, depending on the specific application and requirements. For similar performance and features, consider the Xilinx Artix-7 series as a newer alternative. Always verify compatibility based on design needs.
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