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XC3S400AN-4FTG256C

Name: XC3S400AN-4FTG256C
Rating: 4.7 (12 reviews)

IC FPGA 195 I/O 256FTBGA

제조업체
Mfr.부분 #XC3S400AN-4FTG256C
패키지 256-LBGA
데이터시트
재고 있음7312

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100% 원래 &새로운

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사양

Supplier	AMD Xilinx
Package	Tray
Series	Spartan®-3AN
ProductStatus	Active
NumberofLABs/CLBs	896
NumberofLogicElements/Cells	8064
TotalRAMBits	368640
NumberofI/O	195
NumberofGates	400000
Voltage-Supply	1.14V ~ 1.26V
MountingType	Surface Mount
OperatingTemperature	0°C ~ 85°C (TJ)
Package/Case	256-LBGA

개요

Description

XC3S400AN-4FTG256C is a Xilinx Spartan-3S CPLD device. It offers about 400 logic elements (LEs) for glue logic, small state machines, and simple control/data-path tasks. The device is packaged in a 256-pin Fine-Pitch Grid Array (FTG256) with a C variant, and has speed grade -4 for faster I/O timing. It supports multiple I/O banks and standard CPLD features such as programmable logic blocks, flip-flops, and dedicated I/O resources, enabling implementations like decoders, counters, interfacing logic, and protocol bridges. Programming and configuration are supported via the device’s JTAG/CONFIG interfaces. This mid-density CPLD is aimed at low-to-medium complexity digital logic in cost-sensitive, size-constrained designs and is suitable for glue logic, simple controllers, and peripheral interfaces in consumer, industrial, or embedded applications.

Features

XC3S400AN-4FTG256C is a Spartan-3 FPGA with:
- About 400K system gates (approx. source-density figure for XC3S400 series)
- Speed grade -4 (faster variant)
- FG256C: 256-pin FineLine BGA package
- LUT-based logic slices (CFG/slice with flip-flop)
- On-chip RAM blocks plus distributed RAM
- DSP/multiplier resources for signal processing
- Clock management: PLLs/DLLs for flexible timing
- Flexible I/O across multiple banks (LVTTL/3.3V I/O; various I/O standards)
- In-system reconfigurability and standard FPGA fabric for logic, memory, and DSP
Note: exact I/O counts and RAM sizes vary by device, so consult the datasheet for precise resources.

Package

FTG256C — a 256-ball Fine-Pit/ Fine-Pitch Ball Grid Array (BGA) package.

Pinout

- Pin count: 256 pins.
- Function: Xilinx Spartan-3AN FPGA (XC3S400AN) in a 256-pin Fine-Pitch TQFP package; ~400K system gates of programmable logic for digital designs (I/O, LUTs/FFs, DSP blocks, etc.).

Manufacturer

- Manufacturer: Xilinx, Inc.
- It is a multinational semiconductor company specializing in programmable logic devices, primarily FPGAs and CPLDs, and the accompanying design software.

Application

XC3S400AN-4FTG256C is a Spartan-3 FPGA (~400K logic gates) with ample I/O, ideal for:
- DSP acceleration and filtering
- Embedded control/instrumentation
- Motor/servo control
- Data acquisition and front-end processing
- Communications interfaces (Ethernet/USB/CAN)
- Modest-resolution video/image processing
- FPGA-based prototyping and custom logic
- Automotive and industrial control
- Cost-sensitive consumer electronics