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XC3S700A-4FGG400C

Name: XC3S700A-4FGG400C
Rating: 4.7 (12 reviews)

IC FPGA 311 I/O 400FBGA

제조업체
Mfr.부분 #XC3S700A-4FGG400C
패키지 400-BGA
데이터시트
재고 있음4094

+BOM은 RFQ는

100% 원래 &새로운

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사양

Supplier	AMD Xilinx
Package	Tray
Series	Spartan®-3A
ProductStatus	Active
NumberofLABs/CLBs	1472
NumberofLogicElements/Cells	13248
TotalRAMBits	368640
NumberofI/O	311
NumberofGates	700000
Voltage-Supply	1.14V ~ 1.26V
MountingType	Surface Mount
OperatingTemperature	0°C ~ 85°C (TJ)
Package/Case	400-BGA

개요

Description

XC3S700A-4FGG400C is a Xilinx Spartan-3S FPGA device. It belongs to the Spartan-3S family, targeted at cost‑sensitive, mid‑density programmable logic. Key characteristics (at a high level):
- 700K system gates density in a 400‑ball FG(G)400 package (FGG400), speed grade -4.
- LUT-based logic blocks with flip-flops, plus distributed RAM and Block RAM, for flexible logic and memory.
- DSP slices for numeric processing and signal‑processing tasks.
- Multiple I/O banks with configurable voltages and high I/O capability, suitable for various interfaces.
- Clock management resources (PLLs) and standard configuration interfaces (JTAG or SPI) for programming.
- Suitable for glue logic, embedded control, DSP, and mid‑range digital applications, where a balance of resources and cost is important.
For exact resource counts (logic elements, RAM blocks, DSP count, IOs) and timing specs, consult the latest Xilinx datasheet and package details.

Features

Key features of XC3S700A-4FGG400C:
- Spartan-3A FPGA with ~700K system gates (logic cells) capacity.
- Speed grade -4 (lower-performance variant within the family).
- Package: 400-ball Fine-Grain Grid Array (FGG400C), RoHS-compliant.
- On-chip memory: block RAM and distributed RAM resources.
- Clocking: one or more PLLs/Digital Clock Managers with global clock routing.
- Flexible I/O: multiple I/O banks with diverse voltage/standards and many user I/Os.
- Configuration and debug: JTAG boundary-scan; multiple config options (serial/parallel, etc.).
- LUT-based logic fabric with flip-flops for general-purpose logic and small DSP-like tasks.
- Commercial temperature range (typical for standard-market use).
Note: exact I/O counts and RAM sizes vary by device family, so refer to the datasheet for precise specifications.

Package

Package: FineLine BGA (FGG400) — a 400-ball Plastic FineLine Ball Grid Array package used by the XC3S700A-4FGG400C.

Pinout

- Pin count: 400 pins (FGG400 package).
- Function: Xilinx Spartan-3S FPGA device (XC3S700A) with about 700K system gates, speed grade -4 (FPGA for implementing digital logic).

Manufacturer

- Manufacturer: Xilinx, Inc. (now a subsidiary of AMD).
- What kind of company: A semiconductor/technology company that designs and manufactures programmable logic devices, primarily FPGAs (and related products like CPLDs and SoCs).

Application

Typical uses are cost-sensitive, mid-range FPGA tasks such as digital signal processing blocks and DSP accelerators; embedded control and motor-control applications; I/O interfacing and glue logic for communications (Ethernet/USB/CAN), data acquisition and instrumentation; consumer electronics and multimedia processing; automotive and industrial automation; and rapid prototyping/education.