XC3S700A-4FTG256C

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XC3S700A-4FTG256C

IC FPGA 161 I/O 256FTBGA

  • 제조업체
  • Mfr.부분 #XC3S700A-4FTG256C
  • 패키지 256-FTBGA
  • 데이터시트
  • 재고 있음5020

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배송 준비 24 시간

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사양

Package Tray
Series Spartan®-3A
ProductStatus Active
NumberofLABs/CLBs 1472
NumberofLogicElements/Cells 13248
TotalRAMBits 368640
NumberofI/O 161
NumberofGates 700000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 256-LBGA

개요

Description

The XC3S700A-4FTG256C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A family. It features 700,000 system gates and is designed for cost-sensitive applications requiring moderate complexity and performance. The device operates at a core voltage of 1.2V and offers various I/O voltage options, making it versatile for different interfacing needs.
This FPGA includes a rich set of resources, such as 32K bits of embedded block RAM and 576 configurable I/O pins, supporting various standards. It has a maximum operating frequency of approximately 200 MHz, enabling efficient processing for applications in communications, automotive, and industrial sectors.
The XC3S700A is packaged in a 256-ball TFBGA format, facilitating compact designs. Its programmable nature allows for rapid prototyping and design iterations, making it ideal for developers looking to implement custom hardware solutions without the need for physical chip fabrication. Overall, the XC3S700A-4FTG256C provides a balance of performance, flexibility, and cost-effectiveness for a wide range of applications.

Features

The XC3S700A-4FTG256C is a member of Xilinx's Spartan-3A FPGA family, designed for low-cost, low-power applications. Key features include:
- Logic Cells: Approximately 700,000 system gates, providing substantial logic resources for various applications.
- Embedded Memory: Up to 40 Kbits of distributed RAM and 1.8 Mbits of block RAM, allowing efficient data storage and processing.
- I/O Pins: 256 I/O pins with support for various I/O standards, enabling flexible interfacing options.
- DSP Slices: Includes dedicated DSP resources for efficient signal processing tasks.
- Configuration: Supports multiple configuration methods including JTAG and SPI.
- Power Efficiency: Low static and dynamic power consumption, making it suitable for battery-powered devices.
- Development Support: Compatible with Xilinx development tools, facilitating design and implementation.
This FPGA is ideal for applications in communications, automotive, consumer electronics, and industrial control, offering a balance of performance and cost-effectiveness.

Package

The XC3S700A-4FTG256C is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically a 256-ball configuration. This package type provides a compact design with good thermal and electrical performance, suitable for various applications in digital signal processing and embedded systems.

Pinout

The XC3S700A-4FTG256C is a Spartan-3A series FPGA from Xilinx. It has a pin count of 256. The primary functions of this FPGA include digital signal processing, control applications, and general-purpose logic. It features a combination of configurable logic blocks (CLBs), input/output blocks (IOBs), and digital signal processing (DSP) slices, making it suitable for various applications in telecommunications, automotive, and industrial sectors.
The device operates at a maximum clock frequency of 100 MHz and supports a range of interfaces, including LVTTL, LVCMOS, and differential signaling. It is designed to offer a balance between performance and power efficiency, catering to applications requiring moderate logic density and processing capabilities.

Manufacturer

The XC3S700A-4FTG256C is manufactured by Xilinx, Inc., a company known for its advanced programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and associated software tools. Founded in 1984 and based in San Jose, California, Xilinx specializes in providing solutions for various applications, including telecommunications, automotive, aerospace, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), which has further expanded its capabilities in high-performance computing and adaptive computing technologies.

Application

The XC3S700A-4FTG256C is a Spartan-3 FPGA from Xilinx, widely used in applications such as digital signal processing, embedded systems, telecommunications, automotive electronics, and industrial automation. Its versatility allows for custom hardware implementations in areas like video processing, data acquisition, and control systems. The device is ideal for prototyping, low-power designs, and cost-sensitive applications due to its balance of performance and affordability.

Equivalent

The XC3S700A-4FTG256C is a Spartan-3 FPGA from Xilinx. Equivalent products include:
1. XC3S700A-4FG320C - Same family, different package.
2. XC3S500E-4FG320C - Slightly lower capacity, similar family.
3. Lattice ECP3-70 - Comparable performance in an alternate brand.
4. Intel (Altera) Cyclone III EP3C70 - Similar specifications in the Cyclone series.
Always check for specific feature compatibility before substitution.

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