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XC5VSX35T-1FFG665C
IC FPGA 360 I/O 665FCBGA
- 제조업체
- Mfr.부분 #XC5VSX35T-1FFG665C
- 패키지 665-BBGA, FCBGA
- 데이터시트
- 재고 있음9735
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Supplier | AMD Xilinx |
| Package | Tray |
| Series | Virtex®-5 SXT |
| ProductStatus | Active |
| NumberofLABs/CLBs | 2720 |
| NumberofLogicElements/Cells | 34816 |
| TotalRAMBits | 3096576 |
| NumberofI/O | 360 |
| Voltage-Supply | 0.95V ~ 1.05V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 665-BBGA, FCBGA |
개요
Description
XC5VSX35T-1FFG665C is a Virtex-5 SX FPGA from Xilinx. It’s a 65‑nm device aimed at DSP‑heavy and high‑throughput I/O applications. The name encodes: ~35k logic‑cell class (35T), speed grade -1 (fast), FFG665C = 665‑ball fine‑pitch BGA package, Commercial temperature range (C). Core features typically include a large number of configurable logic blocks with DSP slices, Block RAM and distributed RAM, multiple I/O banks, and high‑speed serial I/O capability. It’s programmed with Xilinx ISE Design Suite and supports standard IP cores for memory, SERDES, PCIe, etc. Typical uses: digital signal processing, video/imaging, telecommunications, data acquisition, and embedded systems. Note: Virtex‑5 is a legacy/older generation; verify tool/IP support and power/availability for current designs.
Features
Here are the main features of XC5VSX35T-1FFG665C (Virtex-5 SX, 665‑pin FFGB, speed grade -1):
- 65 nm Virtex-5 SX FPGA in a 665‑pin FFGB package
- Approximately 35k logic cells (LUT-based fabric)
- Rich DSP resources for high‑speed math and signal processing
- Block RAM and distributed RAM for on‑chip memory
- Flexible clocking with multiple PLLs/pathways
- Large I/O banks with diverse I/O standards (LVDS/LVCMOS/SSTL etc.)
- Industrial temperature range option available
- Configuration and power-management features suitable for embedded systems
- Compatible with standard Xilinx design flows and IP cores
Note: For exact counts (logic cells, BRAM bits, DSP slices, I/O count, PLLs, etc.), please refer to the official Xilinx product specification for this device revision.
- 65 nm Virtex-5 SX FPGA in a 665‑pin FFGB package
- Approximately 35k logic cells (LUT-based fabric)
- Rich DSP resources for high‑speed math and signal processing
- Block RAM and distributed RAM for on‑chip memory
- Flexible clocking with multiple PLLs/pathways
- Large I/O banks with diverse I/O standards (LVDS/LVCMOS/SSTL etc.)
- Industrial temperature range option available
- Configuration and power-management features suitable for embedded systems
- Compatible with standard Xilinx design flows and IP cores
Note: For exact counts (logic cells, BRAM bits, DSP slices, I/O count, PLLs, etc.), please refer to the official Xilinx product specification for this device revision.
Package
Flip-Chip Ball Grid Array (FFG) package, 665-ball (FFG665), RoHS-compliant.
Pinout
- Pin count: 665 pins (FFG665C package)
- Function: Xilinx Virtex-5 SX FPGA (XC5VSX35T) with ~35k logic cells, a reprogrammable integrated digital logic device (FPGA) in the FFG665 package.
- Function: Xilinx Virtex-5 SX FPGA (XC5VSX35T) with ~35k logic cells, a reprogrammable integrated digital logic device (FPGA) in the FFG665 package.
Manufacturer
Manufacturer: Xilinx (now part of AMD).
What kind of company: A semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs (field-programmable gate arrays) and related IP/tools.
What kind of company: A semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs (field-programmable gate arrays) and related IP/tools.
Application
Typical application areas for XC5VSX35T-1FFG665C include:
- High-speed communications (optical networks, switches/routers, SONET/SDH)
- Wireless infrastructure and RF front-ends (base stations, SDR)
- DSP-intensive video/image processing and broadcasting
- Embedded processing and hardware accelerators
- Test and measurement equipment
- Aerospace/defense avionics and radar, and general prototyping/reconfigurable computing platforms
- High-speed communications (optical networks, switches/routers, SONET/SDH)
- Wireless infrastructure and RF front-ends (base stations, SDR)
- DSP-intensive video/image processing and broadcasting
- Embedded processing and hardware accelerators
- Test and measurement equipment
- Aerospace/defense avionics and radar, and general prototyping/reconfigurable computing platforms
배송
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배송 요금 참조 (DHL/FedEx):
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UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
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