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XC6SLX45-3FGG484C
IC FPGA 316 I/O 484FBGA
- 제조업체
- Mfr.부분 #XC6SLX45-3FGG484C
- 패키지 FCBGA-484
- 데이터시트
- 재고 있음2859
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 3411 |
| NumberofLogicElements/Cells | 43661 |
| TotalRAMBits | 2138112 |
| NumberofI/O | 316 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 484-BBGA |
개요
Description
Key specifications include: 484 ball grid array (BGA) package, 3.3V I/O voltage support, and a maximum clock frequency of up to 550 MHz. The XC6SLX45-3FGG484C supports a range of interfaces, including SPI, I2C, and UART, and offers multiple I/O options for flexible connectivity.
Additionally, the Spartan-6 series incorporates features like integrated memory, high-speed transceivers, and digital signal processing capabilities, making it versatile for applications in automotive, industrial automation, consumer electronics, and telecommunications. The device is programmable using Xilinx's ISE Design Suite, which supports various design methodologies, including RTL, high-level synthesis, and system-level design.
Features
1. Logic Cells: Offers 45,000 logic cells, providing a balance of performance and power efficiency.
2. Configurable I/O: Supports up to 72 I/O pins with various voltage standards, allowing flexibility in interfacing.
3. Memory: Includes up to 4.8 Mb of block RAM for data storage and buffering.
4. DSP Slices: Contains 30 DSP slices optimized for high-performance arithmetic operations, ideal for digital signal processing applications.
5. Speed Grade: Rated at speed grade -3, suitable for moderate performance requirements.
6. Power: Designed for low power consumption, making it suitable for battery-operated devices.
7. Package: Housed in a 484-pin FGG (Fine Pitch Ball Grid Array) package, facilitating high-density designs.
8. Configuration: Supports multiple configuration methods including JTAG, SPI, and parallel flash.
This FPGA is widely used in applications such as communications, automotive, and industrial automation due to its versatility and performance.
Package
Pinout
This FPGA is designed for low-power applications and provides a combination of logic resources, memory, and high-speed I/O capabilities. It includes 45,000 logic cells, with additional features such as digital signal processing (DSP) slices and block RAM. The "3" in the part number indicates the speed grade, which affects the performance characteristics.
The package type "FGG" specifies a Fine Pitch Ball Grid Array (FBGA) configuration, suitable for high-density applications. This FPGA can be used in various applications, including communications, automotive, and consumer electronics, where flexibility and low power consumption are essential.
Manufacturer
Application
Equivalent
1. Lattice ECP5 - ECP5-5G-85F.
2. Intel Cyclone IV - EP4CE55F23C7.
3. Microsemi SmartFusion - M2S100.
4. Xilinx Artix-7 – XC7A50T-1FGG484.
These alternatives offer similar performance and functionality but vary in features and architecture. Always verify compatibility for specific applications.
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
Payment Methods
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