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XC7Z030-L2FFG676I
IC SOC CORTEX-A9 800MHZ 676FCBGA
- 제조업체
- Mfr.부분 #XC7Z030-L2FFG676I
- 패키지
- 데이터시트
- 재고 있음2920
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Series | Zynq®-7000 |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Base Product Number | XC7Z030 |
개요
Description
Key specifications include a 1 GHz processing speed, support for advanced connectivity interfaces, and multiple I/O options. The chip is housed in a 676-ball FFG package and is designed for low power consumption while maintaining high performance. The architecture allows for flexible hardware and software integration, enabling developers to leverage both the processing power of the ARM cores and the configurability of the FPGA.
This SoC is ideal for applications requiring real-time processing, signal processing, and complex algorithm implementations, making it a popular choice in the development of innovative solutions across various industries.
Features
1. Processing System: Dual-core ARM Cortex-A9 running up to 1 GHz.
2. FPGA Logic: 30,000 logic cells with high-speed configurable logic blocks.
3. Memory: Supports DDR3, DDR2, and LPDDR2 memory interfaces.
4. I/O Capabilities: 54 general-purpose I/O (GPIO) pins and various communication interfaces, including UART, SPI, I2C, and CAN.
5. Performance: Up to 1.0 TFLOPS (theoretical peak performance).
6. Power: Low power consumption, typically around 5W.
7. Package: Available in a 676-ball FFG package.
8. Connectivity: Integrated Ethernet MAC and USB 2.0 support.
This device is ideal for applications in embedded systems, automotive, industrial, and consumer electronics.
Package
Pinout
The pin functions include general-purpose I/O (GPIO), dedicated power and ground pins, configuration pins, and various interfaces such as I2C, SPI, UART, and more. The device also supports high-speed connectivity through interfaces like USB, Ethernet, and PCIe, depending on the specific configuration and design requirements.
The package type is FFG (Fine Pitch Ball Grid Array), providing a compact footprint suitable for various applications in embedded systems, communications, automotive, and industrial control.
Manufacturer
Application
Equivalent
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
Payment Methods
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현재, 우리는 아래 지불 방법만 받아들입니다.:
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