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XC7Z035-2FFG676I
IC SOC CORTEX-A9 800MHZ 676FCBGA
- 제조업체
- Mfr.부분 #XC7Z035-2FFG676I
- 패키지 FCBGA-676
- 데이터시트
- 재고 있음5977
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Package | Tray |
| Series | Zynq®-7000 |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAMSize | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| PrimaryAttributes | Kintex™-7 FPGA, 275K Logic Cells |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 676-BBGA, FCBGA |
개요
Description
Key specifications include:
- Architecture: Dual-core ARM Cortex-A9 for high-performance processing.
- FPGA Fabric: Configurable logic blocks for custom hardware acceleration.
- I/O: 76 I/O pins, supporting various interfaces like SPI, I2C, and UART.
- Memory: Supports external memory interfaces, enhancing flexibility.
- Power: Designed for low power consumption, ideal for portable applications.
The XC7Z035 is favored for applications that require a balance of software programmability and hardware performance, enabling developers to create complex solutions efficiently. Its integration of a processor and FPGA allows for concurrent processing and rapid prototyping.
Features
- Dual-core ARM Cortex-A9: Operates at up to 1 GHz, supporting advanced processing tasks.
- FPGA Fabric: 35,000 logic cells offering high flexibility for custom hardware accelerations.
- Memory Interfaces: Supports DDR3/DDR3L memory with a maximum of 1 GB.
- I/O Capabilities: 76 programmable I/O pins, including support for various communication interfaces (UART, SPI, I2C, etc.).
- Performance: Capable of high-performance computing with a DSP slice count of 90, enabling efficient signal processing.
- Connectivity: Integrated Gigabit Ethernet and USB 2.0 interfaces for robust connectivity options.
- Package: Available in a 676-ball FFG package.
This SoC is ideal for embedded applications requiring high processing power combined with programmable logic, such as in industrial automation, automotive, and telecommunications.
Package
Pinout
The device supports multiple functionalities such as digital signal processing, embedded processing, and high-speed communication, making it suitable for applications in automotive, industrial, and consumer electronics. The package type is FFG (Fine Pitch Ball Grid Array), which facilitates high-density connections and efficient thermal management.
Manufacturer
Application
Equivalent
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
Payment Methods
지불 기간은 100% 사전 지불입니다.
현재, 우리는 아래 지불 방법만 받아들입니다.:
1. PayPal
2. 신용/직불 카드
3. 전선 전송
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