XCAU25P-2FFVB676E

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XCAU25P-2FFVB676E

IC FPGA ARTIX UP 676FCBGA

  • 제조업체
  • Mfr.부분 #XCAU25P-2FFVB676E
  • 패키지 BGA-676
  • 데이터시트
  • 재고 있음7831

100% 원래 &새로운

배송 준비 24 시간

365 일 보장

RFQ 및더 많은 할인

사양

Package Tray
Series Virtex® UltraScale+™
ProductStatus Active
NumberofLABs/CLBs 17625
NumberofLogicElements/Cells 308437
TotalRAMBits 11010048
NumberofI/O 280
Voltage-Supply 0.825V ~ 0.876V
MountingType Surface Mount
OperatingTemperature 0°C ~ 100°C (TJ)
Package/Case 676-BBGA, FCBGA

개요

Description

The XCAU25P-2FFVB676E is a versatile and powerful system-on-chip (SoC) from Xilinx's UltraScale+ architecture, designed for high-performance applications including data centers, automotive, and industrial automation. It features a combination of programmable logic and hardened processing elements, enabling efficient parallel processing and high-throughput performance. The device integrates a dual-core ARM Cortex-A53 processor, an ARM Cortex-R5 real-time processor, and a large amount of programmable logic fabric, allowing for flexible hardware acceleration and customization.
The "25P" refers to the device's logic cell count, while "2FFVB676" indicates the package type and pin configuration. With support for various I/O standards and high-speed interfaces like PCIe, Ethernet, and Serial Transceivers, it is suited for applications requiring dynamic and scalable solutions. The XCAU25P-2FFVB676E supports advanced features like AI/ML acceleration, making it suitable for modern applications needing high computational power and flexibility.

Features

The XCAU25P-2FFVB676E is a versatile FPGA (Field-Programmable Gate Array) from Xilinx's UltraScale+ family. It features 25K logic cells, delivering high performance for complex applications. The device includes integrated DSP slices, allowing efficient digital signal processing, and high-speed serial transceivers for robust communication.
Key features include:
1. Logic Density: 25,000 logic cells for diverse application needs.
2. DSP Slices: Optimized for processing-intensive tasks, enhancing performance in signal processing.
3. Transceivers: Multiple high-speed transceivers support various protocols, ensuring reliable data transmission.
4. Memory: Embedded block RAM (BRAM) for efficient data handling.
5. Power Efficiency: Designed for low power consumption, making it suitable for battery-operated devices.
6. Flexible I/O: Supports a wide range of I/O standards for compatibility with various peripherals.
Overall, the XCAU25P-2FFVB676E is ideal for applications in telecommunications, automotive, industrial automation, and more, offering a balance of performance, flexibility, and efficiency.

Package

The XCAU25P-2FFVB676E is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically a 676-ball configuration. This type of package supports high-density interconnections and is designed for efficient thermal management and electrical performance in advanced applications.

Pinout

The XCAU25P-2FFVB676E is a device from the Xilinx Versal Adaptive Compute Acceleration Platform series. It features a pin count of 676 pins.
The primary functions of the XCAU25P include high-performance processing, adaptable data processing, and efficient integration of various workloads, making it suitable for data center, 5G, and AI applications. The device integrates programmable logic, a multi-core processing system, and various interfaces for connectivity, which enables it to handle diverse tasks efficiently.
For more detailed specifications, including exact functionalities of individual pins, consulting the official datasheet or user guide is recommended.

Manufacturer

The XCAU25P-2FFVB676E is manufactured by Xilinx, a part of AMD (Advanced Micro Devices). Xilinx specializes in field-programmable gate arrays (FPGAs), system-on-chip (SoC) devices, and adaptive computing solutions. Founded in 1984, the company is known for its innovative programmable logic devices that enable a wide range of applications across various industries, including telecommunications, automotive, aerospace, and industrial automation. Xilinx products are widely used for their flexibility and ability to be reconfigured to meet specific application needs. In 2020, Xilinx was acquired by AMD, further enhancing AMD's portfolio in the semiconductor market.

Application

The XCAU25P-2FFVB676E is a versatile FPGA (Field Programmable Gate Array) used in applications such as aerospace and defense, automotive systems, industrial automation, machine learning, and communications. Its capabilities support high-speed data processing, real-time signal processing, and image processing tasks, making it suitable for complex and demanding embedded systems.

Equivalent

The XCAU25P-2FFVB676E chip is an ultra-low power FPGA from Xilinx's Versal ACAP family. Equivalent products include:
1. Xilinx Zynq UltraScale+ series (e.g., ZU3EG)
2. Intel (Altera) Stratix 10 FPGAs
3. Microchip PolarFire FPGAs
These alternatives may vary in performance and features, so consulting specific datasheets for compatibility is recommended.

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