XCV300E-6FG256C

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XCV300E-6FG256C

IC FPGA 176 I/O 256FBGA

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배송 준비 24 시간

365 일 보장

RFQ 및더 많은 할인

사양

Series Virtex®-E
Part Status Obsolete
DigiKey Programmable Not Verified
Total RAM Bits 131072
Number of I/O 176
Number of Gates 411955
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FBGA (17x17)
Base Product Number XCV300E
Number of Logic Elements/Cells 6912
Number of LABs/CLBs 1536

개요

Description

The XCV300E-6FG256C is a field-programmable gate array (FPGA) from Xilinx's Virtex series, designed for high-performance applications in digital logic design. It features a capacity of approximately 300,000 logic gates and is built on a 0.18-micron process technology. The "6" in the part number indicates the speed grade, while "FG256" refers to the 256-pin Fine Pitch Ball Grid Array (FBGA) package configuration.
This FPGA is known for its flexibility, allowing designers to program and reprogram the hardware to accommodate various applications. It supports a wide range of I/O standards and includes dedicated resources such as digital signal processing (DSP) slices, block RAM, and multipliers, making it suitable for tasks like signal processing, telecommunications, and embedded systems.
The XCV300E-6FG256C is often chosen for its balance of performance, power efficiency, and reconfigurability, making it ideal for prototyping and production in diverse industries.

Features

The Xilinx XCVC300E-6FG256C is a member of the Virtex-6 FPGA family, featuring a range of high-performance capabilities. Key features include:
1. Logic Cells: 300,000 logic cells, providing substantial processing power.
2. DSP Slices: Integrated DSP (Digital Signal Processing) slices for high-speed arithmetic operations.
3. Block RAM: Up to 16 Mb of block RAM for efficient data storage and retrieval.
4. I/O Pins: 256 I/O pins with support for various signaling standards, enabling flexible interfacing.
5. High-Speed Serial Transceivers: Up to 12 high-speed transceivers for fast data communication.
6. Low Power Consumption: Designed for energy efficiency, making it suitable for power-sensitive applications.
7. Flexible Architecture: Supports various design paradigms, including complex algorithms and diverse applications.
8. Enhanced Security Features: Built-in security options to protect IP and designs against unauthorized access.
This FPGA is ideal for applications in telecommunications, automotive, industrial control, and more, offering a balance of performance and efficiency.

Package

The XCV300E-6FG256C is packaged in a Fine Pitch Ball Grid Array (FBGA) with 256 balls. This type of package provides a compact design for higher density and improved thermal performance in FPGA applications.

Pinout

The XCV300E-6FG256C is a Field Programmable Gate Array (FPGA) from Xilinx's Virtex series. It features a pin count of 256. The device is designed for applications requiring high performance and flexibility.
Key functions of the XCV300E series include support for various digital logic designs, programmable interconnects, and I/O capabilities. It offers multiple I/O standards, including LVTTL, LVCMOS, and others, allowing for integration with different logic levels. Additionally, the device supports advanced features such as embedded block RAM, DSP slices, and configurable logic blocks to facilitate complex designs in communications, automotive, and industrial applications.
Overall, the XCV300E-6FG256C is notable for its versatility and capability to be reconfigured for various tasks post-manufacture.

Manufacturer

The XCV300E-6FG256C is manufactured by Xilinx, Inc., a company known for its development of programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and other related technologies. Founded in 1984 and headquartered in San Jose, California, Xilinx specializes in providing solutions for a variety of markets, including telecommunications, automotive, aerospace, and industrial applications. The company is recognized for its innovation in programmable logic and has played a significant role in the evolution of digital electronics. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding its capabilities in the semiconductor space.

Application

The XCV300E-6FG256C is a Field Programmable Gate Array (FPGA) often used in applications such as digital signal processing, telecommunications, aerospace and defense, industrial automation, and embedded systems. Its flexibility allows for custom hardware implementations, making it suitable for prototyping, video and image processing, and high-speed data handling in various electronic designs.

Equivalent

The XCV300E-6FG256C is a Xilinx Virtex 3000E FPGA. Equivalent products include the XCV300-6FG256, XCV300E-6FG456, and other FPGAs from the Xilinx Virtex series like the Virtex-II family. For modern alternatives, consider Xilinx Artix-7 or Spartan-6 FPGAs, depending on specific application requirements regarding performance and features.

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UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.

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