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XCVU13P-2FHGA2104E
IC FPGA 832 I/O 2104FCBGA
- 제조업체
- Mfr.부분 #XCVU13P-2FHGA2104E
- 패키지 FBGA-2104
- 데이터시트
- 재고 있음3879
100% 원래 &새로운
배송 준비 24 시간
365 일 보장
RFQ 및더 많은 할인
사양
| Package | Tray |
| Series | Virtex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 216000 |
| NumberofLogicElements/Cells | 3780000 |
| TotalRAMBits | 514867200 |
| NumberofI/O | 832 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 2104-BBGA, FCBGA |
개요
Description
Key specifications include:
- Logic Cells: It offers a large number of configurable logic cells, enabling complex designs.
- Memory: The device includes significant on-chip memory resources, enhancing data handling capabilities.
- I/O Capabilities: It supports various high-speed interfaces, allowing for versatile connectivity options.
- Power Efficiency: Designed for low-power operation, it enables high performance with reduced energy consumption.
- 400G Ethernet and PCIe Support: It is well-suited for applications requiring high bandwidth and fast data transfer.
The XCVU13P is particularly suitable for edge computing, AI inference, and large-scale telecom processing. Its programmability allows for customization, making it a popular choice for engineers looking to implement specific functionalities in hardware.
Features
1. Architecture: Utilizes a 16nm FinFET process technology, enabling higher performance and lower power consumption.
2. Logic Cells: Offers up to 1.5 million logic cells, suitable for complex designs and applications.
3. DSP Slices: Includes around 8,000 DSP slices, ideal for signal processing tasks.
4. Memory: Provides extensive on-chip memory options, including block RAM (BRAM) and UltraRAM for enhanced data handling capabilities.
5. I/O: Supports high-speed I/O interfaces, including PCIe Gen4, featuring up to 32 lanes for rapid data transfer.
6. Connectivity: Integrated high-speed transceivers capable of 28 Gbps for reliable communication.
7. Design Flexibility: Supports various design methodologies, including RTL, C/C++, and high-level synthesis (HLS).
8. Power Efficiency: Designed for optimized power management, suitable for both performance-intensive and power-sensitive applications.
Overall, the XCVU13P-2FHGA2104E is engineered for advanced computing tasks in data centers, telecommunications, and industrial applications.
Package
Pinout
Manufacturer
Application
Equivalent
배송
배송 방법We
DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.
배송 요금 참조 (DHL/FedEx):
DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.
FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.
EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.
등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.
지불
Payment Methods
지불 기간은 100% 사전 지불입니다.
현재, 우리는 아래 지불 방법만 받아들입니다.:
1. PayPal
2. 신용/직불 카드
3. 전선 전송
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