XCVU3P-2FFVC1517E

이미지는 참조용만

XCVU3P-2FFVC1517E

IC FPGA 520 I/O 1517FCBGA

  • 제조업체AMD
  • Mfr.부분 #XCVU3P-2FFVC1517E
  • 패키지
  • 데이터시트
  • 재고 있음6984

100% 원래 &새로운

배송 준비 24 시간

365 일 보장

RFQ 및더 많은 할인

사양

Series Virtex® UltraScale+™
Part Status Active
DigiKey Programmable Not Verified
Number of Logic Elements/Cells 862050
Total RAM Bits 130355200
Number of I/O 520
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)
Base Product Number XCVU3
Number of LABs/CLBs 49260

개요

Description

The XCVU3P-2FFVC1517E is a high-performance FPGA (Field-Programmable Gate Array) from Xilinx's Virtex UltraScale+ family. It features a large number of configurable logic blocks (CLBs), high-speed serial transceivers, and advanced signal processing capabilities. Designed for applications requiring high bandwidth and low latency, it supports a variety of protocols including PCIe, Ethernet, and high-speed interconnects.
Key specifications include 3 million logic cells, 1,150 DSP slices for digital signal processing applications, and extensive memory resources. The device is available in a 1517-ball FFG package, which facilitates high-density designs and provides a balanced I/O configuration.
The XCVU3P is ideal for applications in data centers, telecommunications, and industrial automation, enabling developers to implement complex algorithms and accelerate data processing tasks with ease. It supports development through Xilinx’s Vivado Design Suite, offering tools for hardware design, simulation, and debugging. This makes the XCVU3P a versatile choice for engineers looking to leverage FPGA technology in cutting-edge applications.

Features

The XCVU3P-2FFVC1517E is a model from Xilinx's UltraScale+ family of FPGAs (Field Programmable Gate Arrays). Key features include:
1. Architecture: Built on a 16nm FinFET process technology, enabling higher performance and lower power consumption.
2. Logic Cells: Approximately 1.3 million logic cells, offering extensive programmable logic resources for complex applications.
3. DSP Slices: Contains a significant number of DSP48E2 slices for high-performance digital signal processing tasks.
4. Memory: Includes embedded block RAM (BRAM) and UltraRAM, providing flexible memory options for data storage.
5. I/O Ports: Supports high-speed serial transceivers for data communication, with numerous I/O configurations.
6. Power Management: Enhanced power options for efficiency and thermal management, suitable for a wide range of applications.
7. Applications: Ideal for data centers, telecommunications, automotive, and industrial applications requiring high performance and adaptability.
This FPGA is designed for applications that demand high throughput and flexibility in processing and connectivity.

Package

The XCVU3P-2FFVC1517E is packaged in a FFG (Fine Pitch Flip Chip) package type with a 1517-ball configuration.

Pinout

The XCVU3P-2FFVC1517E is a member of the Xilinx Virtex UltraScale+ FPGA family. It features a total of 1517 pins. The pin functions include a variety of capabilities such as general-purpose I/O (GPIO), high-speed serial transceivers, power, ground, and configuration pins. The FPGA supports a range of interfaces including LVDS, PCIe, and additional high-speed communication protocols. It is designed for applications requiring high performance, low latency, and flexibility in digital design, making it suitable for data centers, communications, and advanced signal processing tasks.

Manufacturer

The manufacturer of the XCVU3P-2FFVC1517E is Xilinx, Inc., which is a technology company known for designing and producing programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and other related products. Xilinx is recognized for its innovative solutions in various industries, such as telecommunications, automotive, aerospace, and data centers. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), which further expanded its portfolio in the semiconductor market. The XCVU3P-2FFVC1517E is part of the Virtex UltraScale+ FPGA family, known for high performance and versatility in handling complex computing tasks and applications.

Application

The XCVU3P-2FFVC1517E is a high-performance FPGA from Xilinx, commonly used in areas such as high-speed data processing, telecommunications, machine learning, video and image processing, and embedded systems. Its versatility makes it suitable for applications in aerospace, automotive, industrial automation, and data center acceleration, enabling real-time processing and complex computation tasks.

Equivalent

The XCVU3P-2FFVC1517E chip is part of the Xilinx Virtex UltraScale+ family. Equivalent products include the XCVU3P-1FFVC1517E (lower speed grade) and other Virtex UltraScale+ models such as XCVU4P and XCVU5P, depending on specific design requirements like resources and features. For exact replacements, consult the Xilinx product documentation or equivalency matrices.

배송

배송 방법We

DHL, FedEx, TNT, UPS 또는 선택한 다른 운송업체를 통해 글로벌 배송 서비스를 제공합니다.


배송 요금 참조 (DHL/FedEx):

DHL은: 배송 비용은 $25-$45 (0.5kg)에서 2-5 영업일의 추정적 배달 시간이 있습니다.

FedEx는: 배송 비용은 $25-$40 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

UPS는: 배송 비용은 $25-$45 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

TNT는: 배송 비용은 $25-$65 (0.5kg)에서 3-7 영업일의 추정적 배달 시간을 가지고 있습니다.

EMS는: 배송 비용은 $30-$50 (0.5kg)에서 7-15 영업일의 추정적 배달 시간을 제공합니다.

등록된 항공우편: 배송 비용은 $2-$4 (0.1kg), 예상 배달 시간 5-20 영업일.

지불

Payment Methods

지불 기간은 100% 사전 지불입니다.

현재, 우리는 아래 지불 방법만 받아들입니다.:

1. PayPal

2. 신용/직불 카드

3. 전선 전송