XCVU5P-2FLVA2104E

XCVU5P-2FLVA2104E is a Xilinx Virtex UltraScale+ FPGA. It’s a mid-to-high density device built on a 16nm FinFET process, designed for high-performance data-path, networking, DSP, and compute-acceleration workloads.
Key points:
- Family and architecture: Virtex UltraScale+ FPGA (non-SoC), suited for demanding FPGA applications.
- Package and speed: -2 speed grade in an FLVA2104E flip-chip land-grid array package with 2104 balls; suffix "E" relates to the packaging/temperature option per the catalog.
- Resources and capabilities (high level): large pool of logic cells, DSP slices, BRAM/UltraRAM, and multi-gigabit transceivers across many I/O banks for flexible interfacing to memory, optics, or backplanes.
- Typical uses: high-speed networking, video/data processing, radar/communications, and other accelerator-type workloads.
Note: exact resource counts (logic cells, DSPs, RAM, transceiver tally) and supported interfaces should be confirmed in the official datasheet and Vivado/flow guides for this specific SKU.

XCVU5P-2FLVA2104E is a Versal ACAP device in a FLVA2104 package. Key features (high level):
- Heterogeneous compute: programmable logic (PL), hardened AI Engine array for ML/DSP tasks, plus scalar/specialized compute blocks.
- AI/ML acceleration: dedicated AI Engine cores integrated for inference and data processing.
- High-bandwidth fabric and memory: on-chip Block RAM/UltraRAM and interconnected high-speed interconnects for data movement.
- I/O and interfaces: multi-protocol high-speed transceivers and I/O options (PCIe and other common high-speed interfaces).
- Security: hardware root of trust, cryptographic engines, secure boot and tamper-detection features.
- Packaging and environment: Flip-Chip Ball Grid Array (FLGA) 2104-ball package; industrial/temperature options available.
- Applications: data center acceleration, 5G/telecom, automotive, defense and other heterogeneous compute workloads.
Note: Exact numbers (logic cells, AI Engine count, transceiver speeds, memory capacity) vary; please consult the Xilinx datasheet/product guide for XCVU5P-2FLVA2104E for precise specifications.

FLVA stands for a Flip-Chip Land Grid Array (FLGA/LGA style) package used for the XCVU5P device.

Pin count: 2104 pins. Function: XCVU5P-2FLVA2104E is a Xilinx Versal ACAP device (XCVU5P) in a 2104-pin Flip-Chip Land Grid Array (FLVA2104E) package, i.e., a Versal ACAP accelerator/FPGA platform with programmable logic, AI Engines, and DSPs for high-performance compute.

- Manufacturer: AMD (Xilinx). XCVU5P-2FLVA2104E is from Xilinx’s Versal family; Xilinx is now a subsidiary of AMD.
- What kind of company: A multinational semiconductor company that designs and manufactures processors, GPUs, and programmable logic devices (FPGAs/ACAPs); acquired Xilinx in 2020 to expand in FPGAs and adaptive compute platforms.

XCVU5P-2FLVA2104E is a Versal ACAP device. Common application areas:
- Data center and edge AI/ML inference and acceleration
- 5G/telecom infrastructure and packet processing
- Video, image and computer-vision processing
- Automotive ADAS and autonomous compute
- Industrial automation and vision systems
- Aerospace/defense signal processing and radar
- Programmable network acceleration and security

XCVU5P-2FLVA2104E is a Versal UltraScale+ U5P device. There are no true non-Xilinx equivalents. Closest equivalents are other Xilinx variants in the same family with the same speed grade but different packaging, e.g., XCVU5P-2FLGA2104E. For exact cross-references, use the Xilinx Product Cross Reference tool or distributor catalogs (Digi-Key, Mouser) by device, package, and speed grade.