XCZU3CG-2SBVA484I

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XCZU3CG-2SBVA484I

IC SOC CORTEX-A53 484FCBGA

  • 제조업체
  • Mfr.부분 #XCZU3CG-2SBVA484I
  • 패키지 FBGA-484
  • 데이터시트
  • 재고 있음6624

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사양

Package Tray
Series Zynq® UltraScale+™ MPSoC CG
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAMSize 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
PrimaryAttributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 484-BFBGA, FCBGA

개요

Description

The XCZU3CG-2SBVA484I is a part of the Xilinx Zynq UltraScale+ MPSoC family, which integrates a processing system (PS) and programmable logic (PL) in a single device. This SoC combines a dual-core ARM Cortex-A53 processor and a dual-core ARM Cortex-R5 real-time processor, along with programmable logic that allows for high customization and parallel processing capabilities.
The device features 1 GB of DDR4 memory interface, multiple high-speed transceivers (up to 12.5 Gbps), and extensive I/O options, making it suitable for a range of applications including embedded systems, automotive, industrial IoT, and video processing.
It operates at a temperature range suitable for industrial applications and supports various design tools, including Vivado Design Suite and Vitis, facilitating hardware and software co-design. The XCZU3CG-2SBVA484I is particularly well-suited for applications requiring both high-performance computing and flexible hardware acceleration.

Features

The XCZU3CG-2SBVA484I is a member of the Xilinx Zynq UltraScale+ MPSoC family, combining a powerful ARM-based processing system with FPGA capabilities. Key features include:
1. Processing System: It integrates a dual-core ARM Cortex-A53 processor and a dual-core ARM Cortex-R5 real-time processor.
2. FPGA Fabric: The device includes a flexible FPGA fabric with a range of programmable logic resources, facilitating custom hardware acceleration.
3. I/O Options: It supports various I/O standards, including LVDS, PCIe, and Ethernet, enabling diverse connectivity.
4. Memory Interfaces: The chip has memory interfaces like DDR4, offering high bandwidth and performance.
5. Power Efficiency: Designed for low power consumption while delivering high performance.
6. Security Features: Incorporates hardware-based security mechanisms for data protection and secure boot.
7. Development Tools: Compatible with Xilinx's Vivado design suite and Vitis for software development.
This combination of features makes the XCZU3CG-2SBVA484I suitable for applications in automotive, industrial, and communications sectors.

Package

The XCZU3CG-2SBVA484I is packaged in a 484-ball FCBGA (Fine Pitch Ball Grid Array) format. This package type allows for high-density connections and efficient thermal management, suitable for various applications in FPGA designs.

Pinout

The XCZU3CG-2SBVA484I is a part of the Xilinx Zynq UltraScale+ MPSoC family. It features a total of 484 pins.
In terms of functionality, the device integrates both a processing system (PS) and programmable logic (PL). The PS includes a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and various peripherals. The programmable logic provides users with the flexibility to implement custom hardware accelerators and interfaces.
The pin functions encompass power supply, ground, I/O interfaces (such as GPIO, SPI, I2C, UART), clock input/output, configuration, and programming interfaces, among others. The arrangement of pins supports high-speed connectivity for various applications, including industrial automation, automotive systems, and telecommunications.

Manufacturer

The XCZU3CG-2SBVA484I is manufactured by Xilinx, Inc., which is a semiconductor company known for its field-programmable gate arrays (FPGAs), system-on-chip (SoC) devices, and adaptive computing solutions. Xilinx is a leader in reconfigurable computing technology and offers products that are widely used in various industries, including telecommunications, automotive, aerospace, and industrial applications. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its portfolio of advanced computing technologies. The company's products enable designers to create flexible and efficient hardware solutions, making them essential in applications that require high performance and adaptability.

Application

The XCZU3CG-2SBVA484I is a Zynq UltraScale+ MPSoC by Xilinx, suitable for applications in industrial automation, automotive systems, medical devices, telecommunications, and aerospace. Its programmable logic and processing capabilities enable real-time data processing, high-speed communication, and flexible hardware acceleration, making it ideal for edge computing, machine learning, and robotics.

Equivalent

The XCZU3CG-2SBVA484I chip is part of Xilinx's Zynq UltraScale+ MPSoC family. Equivalent products include the XCZU2CG-2SBVA484I and XCZU4CG-2SBVA484I, which offer different performance levels and resources. For broader compatibility, consider the Zynq-7000 series as lower-performance alternatives for less demanding applications. Always verify specific requirements like I/O count and processing needs for precise equivalence.

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