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XCZU3EG-1SBVA484E

Name: XCZU3EG-1SBVA484E
Rating: 4.7 (12 reviews)

IC SOC CORTEX-A53 484FCBGA

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Mfr.부분 #XCZU3EG-1SBVA484E
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365 일 보장

RFQ 및더 많은 할인

사양

Series	Zynq® UltraScale+™ MPSOC EG
Part Status	Active
Base Product Number	XCZU3
Architecture	MCU, FPGA
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size	256KB
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed	500MHz, 600MHz, 1.2GHz
Primary Attributes	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature	0°C ~ 100°C (TJ)
Package	484-BFBGA, FCBGA
Supplier Device Package	484-FCBGA (19x19)
Packaging	Tray

개요

Description

XCZU3EG-1SBVA484E is a Xilinx Zynq UltraScale+ MPSoC device that combines a Processing System (ARM Cortex-A53 quad-core and Cortex-R5 real-time cores) with programmable logic (FPGA) on a single chip. The ZU3 density places it in the mid-range UltraScale+ family, offering a balance of CPU performance, PL resources, and high-speed I/O. It comes in a 484-ball BGA package (the 1SBVA484E designation). The part provides memory and I/O interfaces (DDR4/LPDDR4, PCIe, USB, SATA, GigE, etc.), substantial PL resources (LUTs/FFs, BRAM/URAM, DSP slices) and high-speed transceivers for complex hardware accelerators and custom logic. Applications include industrial automation, automotive, communications, video/image processing, and edge computing with hardware acceleration. Development flows use Xilinx Vivado for PL integration and Vitis (or SDK) for software on the PS, with support for Linux or bare-metal environments.

Features

XCZU3EG-1SBVA484E is a Zynq UltraScale+ MPSoC device (ZU3EG) in a 484-ball BGA. Key features:
- Zynq UltraScale+ MPSoC architecture: integrated Processing System (PS) and Programmable Logic (PL)
- PS: ARM Cortex-A53 based processing system (quad-core) with security features
- PL: extensive programmable logic with DSP slices, LUTs, and block RAM
- High-speed serial transceivers and wide I/O support for flexible interfaces
- Memory interfaces and controllers (e.g., DDR/LPDDR, ECC options) and internal buffering
- Peripherals and interfaces: PCIe, USB, SATA, memory card, and other high-speed I/O options
- Video/vision and multimedia capability via hardened IP and accelerators
- Security features: cryptographic accelerators, secure boot, and tamper detection
- Operating temperature: extended temperature range
- Speed grade: -1
- Package: 484-ball BGA, suitable for compact embedded designs
Note: exact counts (logic cells, DSPs, transceivers, etc.) vary by device family revision; consult the datasheet for precise numbers.

Package

A 484-ball BGA package (SBVA484).

Pinout

- Pin count: 484 pins (SBVA484 package, 484-ball BGA)
- Function: Xilinx Zynq UltraScale+ MPSoC device (XCZU3EG) – a heterogeneous system-on-chip with Processing System (PS) and Programmable Logic (PL) for embedded processing and FPGA fabric integration.

Manufacturer

- Manufacturer: Xilinx (now part of AMD).
- What kind of company: A semiconductor company that designs and markets programmable logic devices, notably FPGAs and SoCs (Xilinx is a leading supplier of FPGAs and related technologies).

Application

Applications for XCZU3EG-1SBVA484E include:
- Embedded processing platforms (PS/PL) for real-time, high-bandwidth workloads with hardware acceleration
- Industrial automation and machine vision
- Automotive ADAS, infotainment, and cockpit electronics
- Communications/telecom infrastructure (baseband, packet processing, transceivers)
- Video and imaging (surveillance, medical imaging, broadcast)
- Edge AI and device-level data processing
- Aerospace/defense rugged embedded systems